参数资料
型号: UESD3.3ST5G
厂商: ON Semiconductor
文件页数: 1/4页
文件大小: 0K
描述: DIODE ESD PROTECT 3.3V SOD-723
产品变化通告: Specification Update Max Forward Voltage 18/Jan/2008
Product Discontinuation 04/April/2008
标准包装: 8,000
系列: uESD
电压 - 反向隔离(标准值): 3.3V
电压 - 击穿: 5V
功率(瓦特): 113W
电极标记: 单向
安装类型: 表面贴装
封装/外壳: SOD-723
供应商设备封装: SOD-723
包装: 带卷 (TR)
m ESD3.3ST5G SERIES
ESD Protection Diodes
In Ultra Small SOD-723 Package
The m ESD Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
G
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space comes at a premium.
Specification Features:
? Small Body Outline Dimensions:
0.055 ″ x 0.024 ″ (1.40 mm x 0.60 mm)
? Low Body Height: 0.020 ″ (0.5 mm)
? Stand-off Voltage: 3.3 V - 12 V
? Low Leakage
? Response Time is Typically < 1 ns
? ESD Rating of Class 3 (> 16 kV) per Human Body Model
? IEC61000-4-2 Level 4 ESD Protection
? IEC61000-4-4 Level 4 EFT Protection
? These are Pb-Free Devices
Mechanical Characteristics:
CASE: Void‐free, transfer‐molded, thermosetting plastic
Epoxy Meets UL 94 V-0
LEAD FINISH: 100% Matte Sn (Tin)
http://onsemi.com
1 2
PIN 1. CATHODE
2. ANODE
MARKING
DIAGRAM
XX M G
SOD-723
CASE 509AA
XX = Specific Device Code
M = Date Code
G = Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
Device
m ESDxxST5G
Package
SOD-723
(Pb-Free)
Shipping ?
8000/Tape & Reel
MAXIMUM RATINGS
?For information on tape and reel specifications,
including part orientation and tape sizes, please
Rating
IEC 61000-4-2 (ESD)
IEC 61000-4-4 (EFT)
Air
Contact
Symbol
Value
± 30
± 30
40
Unit
kV
A
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
ESD Voltage
Per Human Body Model
Per Machine Model
16
400
kV
V
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
Total Power Dissipation on FR-5 Board
(Note 1) @ T A = 25 ° C
Junction and Storage Temperature Range
?
P D
T J , T stg
150
-55 to
mW
° C
+150
Lead Solder Temperature - Maximum
T L
260
° C
(10 Second Duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR-5 = 1.0 x 0.75 x 0.62 in.
? Semiconductor Components Industries, LLC, 2008
February, 2008 - Rev. 3
1
Publication Order Number:
UESD3.3ST5G/D
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