参数资料
| 型号： | UESD3.3ST5G |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/4页 |
| 文件大小： | 0K |
| 描述： | DIODE ESD PROTECT 3.3V SOD-723 |
| 产品变化通告： | Specification Update Max Forward Voltage 18/Jan/2008 Product Discontinuation 04/April/2008 |
| 标准包装： | 8,000 |
| 系列： | uESD |
| 电压 - 反向隔离（标准值）： | 3.3V |
| 电压 - 击穿： | 5V |
| 功率（瓦特）： | 113W |
| 电极标记： | 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOD-723 |
| 供应商设备封装： | SOD-723 |
| 包装： | 带卷 (TR) |
m ESD3.3ST5G SERIES
PACKAGE DIMENSIONS
SOD-723
CASE 509AA-01
ISSUE O
D
-X-
E
-Y-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
b
2X
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
0.08 (0.0032) X Y
MILLIMETERS
INCHES
A
DIM
A
MIN NOM MAX
0.49 0.52 0.55
MIN NOM MAX
0.019 0.020 0.022
b
c
0.25 0.28 0.32 0.0098 0.011 0.013
0.08 0.12 0.15 0.0032 0.0047 0.0059
D
E
0.95 1.00 1.05
0.55 0.60 0.65
0.037 0.039 0.041
0.022 0.024 0.026
c
H E
L
H E
L
1.35 1.40 1.45
0.15 0.20 0.25
0.053 0.055 0.057
0.006 0.0079 0.010
SOLDERING FOOTPRINT*
1.1
0.043
0.50
0.0197
0.45
0.0177
SCALE 10:1
mm
inches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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UESD3.3ST5G/D
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