参数资料
型号: UPA2757GR-E2-AT
厂商: Renesas Electronics America
文件页数: 9/10页
文件大小: 0K
描述: MOSFET N-CH DUAL 30V 8-SOIC
标准包装: 2,500
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 5A
开态Rds(最大)@ Id, Vgs @ 25° C: 36 毫欧 @ 3A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 1mA
闸电荷(Qg) @ Vgs: 10nC @ 10V
输入电容 (Ciss) @ Vds: 400pF @ 10V
功率 - 最大: 2W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.173",4.40mm 宽)
供应商设备封装: 8-PSOP
包装: 带卷 (TR)
μ PA2757GR
TAPE INFORMATION
There are two types (-E1, -E2) of taping depending on the direction of the device.
Reel side
? E1 TYPE
? E2 TYPE
Draw-out side
MARKING INFORMATION
A2757
Lot code
1 pin mark
Pb-free plating marking
RECOMMENDED SOLDERING CONDITIONS
The μ PA2757GR should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Infrared reflow
Partial heating
Soldering Conditions
Maximum temperature (Package's surface temperature): 260 ° C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220 ° C: 60 seconds or less
Preheating time at 160 to 180 ° C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Maximum temperature (Pin temperature): 350 ° C or below
Recommended
Condition Symbol
IR60-00-3
P350
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet G18206EJ2V0DS
7
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