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参数资料
型号： UPD78F9212CS-CAB-A
厂商： Renesas Electronics America
文件页数： 46/175页
文件大小： 0K
描述： MCU 8BIT 4KB FLASH 16PIN
标准包装： 400
系列： 78K0S/Kx1+
核心处理器： 78K0S
芯体尺寸： 8-位
速度： 10MHz
外围设备： LVD，POR，PWM，WDT
输入/输出数： 13
程序存储器容量： 4KB（4K x 8）
程序存储器类型： 闪存
RAM 容量： 128 x 8
电压 - 电源 (Vcc/Vdd)： 2 V ~ 5.5 V
数据转换器： A/D 4x10b
振荡器型： 内部
工作温度： -40°C ~ 85°C
封装/外壳： 16-DIP（0.300"，7.62mm）
包装： 托盘
User’s Manual U16994EJ6V0UD
12
16.8 Flash Memory Programming by Self Programming..............................................................232
16.8.1 Outline of self programming .......................................................................................................... 232
16.8.2 Cautions on self programming function ......................................................................................... 235
16.8.3 Registers used for self programming function ............................................................................... 235
16.8.4 Example of shifting normal mode to self programming mode ........................................................ 242
16.8.5 Example of shifting self programming mode to normal mode ........................................................ 245
16.8.6 Example of block erase operation in self programming mode ....................................................... 248
16.8.7 Example of block blank check operation in self programming mode ............................................. 251
16.8.8 Example of byte write operation in self programming mode .......................................................... 254
16.8.9 Example of internal verify operation in self programming mode .................................................... 257
16.8.10 Examples of operation when command execution time should be minimized in self programming
mode ........................................................................................................................................... 261
16.8.11 Examples of operation when interrupt-disabled time should be minimized in self programming
mode ........................................................................................................................................... 268
CHAPTER 17 ON-CHIP DEBUG FUNCTION .......................................................................................279
17.1 Connecting QB-MINI2 to 78K0S/KY1+ ....................................................................................279
17.1.1 Connection of INTP1 pin ............................................................................................................... 280
17.1.2 Connection of X1 and X2 pins ....................................................................................................... 281
17.2 Securing of user resources .....................................................................................................282
CHAPTER 18 INSTRUCTION SET OVERVIEW .................................................................................283
18.1 Operation ...................................................................................................................................283
18.1.1 Operand identifiers and description methods ................................................................................ 283
18.1.2 Description of “Operation” column ................................................................................................. 284
18.1.3 Description of “Flag” column.......................................................................................................... 284
18.2 Operation List ...........................................................................................................................285
18.3 Instructions Listed by Addressing Type ................................................................................290
CHAPTER 19 ELECTRICAL SPECIFICATIONS (Standard product, (A) grade product) ................293
CHAPTER 20 ELECTRICAL SPECIFICATIONS ((A2) grade product)................................................305
CHAPTER 21 PACKAGE DRAWING ..................................................................................................319
CHAPTER 22 RECOMMENDED SOLDERING CONDITIONS...........................................................323
APPENDIX A DEVELOPMENT TOOLS...............................................................................................325
A.1 Software Package ......................................................................................................................328
A.2 Language Processing Software ...............................................................................................328
A.3 Flash Memory Writing Tools .....................................................................................................329
A.3.1 When using flash memory programmer PG-FP5 and FL-PR5 ........................................................ 329
A.3.2 When using on-chip debug emulator with programming function QB-MINI2 ................................... 329
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