参数资料
型号: W25Q128BVEIG
厂商: Winbond Electronics
文件页数: 6/74页
文件大小: 0K
描述: IC SPI FLASH 128MBIT 8WSON
标准包装: 63
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 128M(16M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-WSON(8x6)
包装: 管件
W25Q128BV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q128BV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package
code F) and two 24-ball 8x6-mm TFBGAs (package code B, C) as shown in Figure 1a-c respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pad Configuration WSON 8x6-mm
Top View
/CS
DO (IO 1 )
/WP (IO 2 )
GND
1
2
3
4
8
7
6
5
VCC
/HOLD (IO 3 )
CLK
DI (IO 0 )
Figure 1a. W25Q128BV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E)
3.2
Pad Description WSON 8x6-mm
PAD NO.
1
2
3
4
5
6
7
8
PAD NAME
/CS
DO (IO1)
/WP (IO2)
GND
DI (IO0)
CLK
/HOLD (IO3)
VCC
I/O
I
I/O
I/O
I/O
I
I/O
FUNCTION
Chip Select Input
Data Output (Data Input Output 1)* 1
Write Protect Input ( Data Input Output 2)* 2
Ground
Data Input (Data Input Output 0)* 1
Serial Clock Input
Hold Input (Data Input Output 3)* 2
Power Supply
*1: IO0 and IO1 are used for Standard and Dual SPI instructions
*2: IO0 – IO3 are used for Quad SPI instructions
-6-
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参数描述
W25Q128BVEIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 128M-BIT, 4KB UNIFOR
W25Q128BVEIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q128BVFIG 制造商:Winbond Electronics Corp 功能描述:Flash Serial-SPI 3.3V 128Mbit 16M x 8bit 8.5ns 16-Pin SOIC 制造商:Winbond Electronics Corp 功能描述:128MB SPI FLASH
W25Q128BVFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q128FV 制造商:WINBOND 制造商全称:Winbond 功能描述:SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI