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参数资料
| 型号： | W25Q16BVDAIG |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 2M X 8 SPI BUS SERIAL EEPROM, PDIP8 |
| 封装： | 0.300 INCH, GREEN, PLASTIC, DIP-8 |
| 文件页数： | 65/68页 |
| 文件大小： | 2055K |
| 代理商： | W25Q16BVDAIG |
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W25Q16BV
- 68 -
15. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
08/24/08
New Create Preliminary
B
02/12/09
03/09/09
03/11/09
03/13/09
13, 14, 17, 51,
55, 63 & 64
63
5
13
Added Erase Suspend Status Bit
Removed HPM instruction
Updated max. read frequency
Updated Ordering Information
Added note 2b.
Change Active Current to 4mA
Change QE pin to QE Bit
C
04/23/09
04/30/09
5,7,9,61,65,66
54
Added PDIP Package.
Dual Data Read Icc3 1MHz Max = 8.5ma
Quad Data Read Icc3 1MHz Max = 10ma
D
08/20/09
5, 67
60-65
42, 43
50
Special Order Notes
Updated package diagram
Updated Erase Suspend/Resume descriptions
UID Waveform Corrected
E
11/04/09
68
4
47
51
Removed Preliminiary designator
Corrected PDF TOC error
Update 90h Waveform Diagram
Update 9Fh Waveform Diagram
F
07/08/10
60-65
55, 58
Updated Package Diagrams
Updated parameter VIL/VIH, tSE
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
相关PDF资料 |
PDF描述 |
|---|---|
| W25Q16BVDAIP | 2M X 8 SPI BUS SERIAL EEPROM, PDIP8 |
| W25Q16BVSNIP | 2M X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q40BLSNIP | 4M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q80BVSFIG | 1M X 8 SPI BUS SERIAL EEPROM, PDSO16 |
| W25X32AVZPIG | 4M X 8 FLASH 2.7V PROM, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q16BVDAIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16BVSFIG | 功能描述:IC SPI FLASH 16MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP（0.465"，11.8mm 宽） 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8 |
| W25Q16BVSFIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16BVSNIG | 制造商:Winbond Electronics Corp 功能描述:Flash Serial-SPI 3.3V 16Mbit 2M x 8bit 6ns 8-Pin SOIC |
| W25Q16BVSNIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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