参数资料
型号: W25Q16BVSNIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 2M X 8 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 47/68页
文件大小: 2055K
代理商: W25Q16BVSNIP
W25Q16BV
Publication Release Date: July 08, 2010
- 51 -
Revision F
11.2.31 Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q16BV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh)
and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the
falling edge of CLK with most significant bit (MSB) first as shown in figure 30. For memory type and
capacity values refer to Manufacturer and Device Identification table.
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30 31
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30 31
Figure 30. Read JEDEC ID Instruction Sequence Diagram
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W25Q16BVSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
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