参数资料
型号: W25Q16BVSNIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 2M X 8 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 63/68页
文件大小: 2055K
代理商: W25Q16BVSNIP
W25Q16BV
- 66 -
14.
ORDERING INFORMATION (1)
W 25Q 16B V xx(1)
(2)
I = Industrial (-40°C to +85°C)
SN = 8-pin SOIC 150-mil
ZP = 8-pad WSON 6x5mm
SF = 16-pin SOIC 300-mil
SS = 8-pin SOIC 208-mil
DA = 8-pin PDIP 300-mil
V = 2.7V to 3.6V
16B = 16M-bit
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
W = Winbond
G =
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
P =
Green Package with Status Register Power Lock-Down & OTP enabled
Notes:
1a. Only the 2
nd letter is used for the part marking; WSON package type ZP is not used for the part marking.
1b. The “W” prefix is not included on the part marking.
2a. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape
T) or Tray (shape S), when placing orders.
2b. For shipments with OTP feature enabled, please specify when placing orders.
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