参数资料
型号: W25Q16BVSNIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 2M X 8 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 65/68页
文件大小: 2055K
代理商: W25Q16BVSNIP
W25Q16BV
- 68 -
15. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
08/24/08
New Create Preliminary
B
02/12/09
03/09/09
03/11/09
03/13/09
13, 14, 17, 51,
55, 63 & 64
63
5
13
Added Erase Suspend Status Bit
Removed HPM instruction
Updated max. read frequency
Updated Ordering Information
Added note 2b.
Change Active Current to 4mA
Change QE pin to QE Bit
C
04/23/09
04/30/09
5,7,9,61,65,66
54
Added PDIP Package.
Dual Data Read Icc3 1MHz Max = 8.5ma
Quad Data Read Icc3 1MHz Max = 10ma
D
08/20/09
5, 67
60-65
42, 43
50
Special Order Notes
Updated package diagram
Updated Erase Suspend/Resume descriptions
UID Waveform Corrected
E
11/04/09
68
4
47
51
Removed Preliminiary designator
Corrected PDF TOC error
Update 90h Waveform Diagram
Update 9Fh Waveform Diagram
F
07/08/10
60-65
55, 58
Updated Package Diagrams
Updated parameter VIL/VIH, tSE
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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