参数资料
型号: W25Q32BVSSIG
厂商: Winbond Electronics
文件页数: 52/78页
文件大小: 0K
描述: IC SPI FLASH 32MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 32M(4M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q32BV
7.2.31 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruc tion is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29. The Device ID values for the W25Q32BV is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
28
29
30
31
CLK
Mode 0
Instruction (90h)
Address (000000h)
DI
(IO 0 )
23
*
22
21
3
2
1
0
DO
(IO 1 )
/CS
* = MSB
High Impedance
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
Mode 3
CLK
DI
(IO 0 )
0
Mode 0
DO
(IO 1 )
Manufacturer ID (EFh)
7
*
6
5
4 3
Device ID
2
1
0
Figure 29. Read Manufacturer / Device ID Diagram
- 52 -
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