参数资料
型号: W25Q32BVSSIG
厂商: Winbond Electronics
文件页数: 9/78页
文件大小: 0K
描述: IC SPI FLASH 32MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 32M(4M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q32BV
3.7
Ball Configuration TFBGA 8x6-mm
Top View
Top View
A1
A2
A3
A4
A2
NC
A3
NC
A4
NC
A5
NC
NC
B1
NC
B2
NC
B3
NC
B4
B1
NC
C1
NC
B2
CLK
C2
/CS
B3
GND
C3
NC
B4
VCC
C4
/WP (IO 2 )
B5
NC
C5
NC
NC
C1
NC
D1
CLK
C2
/CS
D2
GND
C3
NC
D3
VCC
C4
/WP (IO 2 )
D4
D1
D2
D3
D4
D5
NC
DO(IO 1 )
DI(IO 0 ) /HOLD(IO 3 )
NC
DO(IO 1 )
DI(IO 0 ) /HOLD(IO 3 )
NC
E1
E2
E3
E4
E1
NC
E2
NC
E3
NC
E4
NC
E5
NC
NC
F1
NC
F2
NC
F3
NC
F4
NC
NC
NC
NC
Package Code TB
Package Code TC
Figure 1e. W25Q32BV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB, TC)
3.8
Ball Description TFBGA 8x6-mm
BALL NO.
B2
B3
B4
C2
C4
D2
D3
D4
Multiple
PIN NAME
CLK
GND
VCC
/CS
/WP (IO2)
DO (IO1)
DI (IO0)
/HOLD (IO3)
NC
I/O
I
I
I/O
I/O
I/O
I/O
FUNCTION
Serial Clock Input
Ground
Power Supply
Chip Select Input
Write Protect Input (Data Input Output 2)* 2
Data Output (Data Input Output 1)* 1
Data Input (Data Input Output 0)* 1
Hold Input (Data Input Output 3)* 2
No Connect
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
Publication Release Date: October 04,2013
-9-
Revision I
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