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参数资料
| 型号： | W25Q32BVSSIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 78/78页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 32MBIT 8SOIC |
| 标准包装： | 90 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 32M（4M x 8） |
| 速度： | 104MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q32BV
11. REVISION HISTORY
VERSION
A
DATE
03/26/09
PAGE
DESCRIPTION
New Create Preliminary
Removed SOIC-8 150-mil in Ordering Section.
5~8, 45, 46, 65~71
Removed PDIP-8 300-mil Package
B
08/20/09
53
Added WSON-8 8x6-mm Package
Updated package diagram
Updated Suspend/Resume description
Updated UID waveform
C
D
E
09/24/09
11/05/09
07/08/10
5,7,9,67,72,73
51, 55
74
63 & 64
64
66-67
69-74
5, 10, 21, 56-58
5, 75 & 76
Added PDIP-8 300-mil Package
Corrected function diagrams
Removed Preliminary designator
Updated AC/DC parameters
Updated VIL/VIH
Updated AC/DC parameters
Updated Package Diagrams
Added SFDP feature
Added automotive temperature
Added TFBGA package
F
04/01/11
9, 76-78, 23-69, 47
57-59
Updated diagrams
Added /WP timing diagram
Updated Suspend description
Updated SFDP to JEDEC 1.0
G
H
I
11/02/11
03/26/12
10/04/13
5, 9, 71, 76, 78-79
57
61, 76-78
5, 61
Added 5x5 ball array TFBGA, VSOP 208mil
Referred to SFDP definition application note
Updated operating temperature grades
Removed automotive grade and industrial plus grade
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur. Winbond customers using or
selling these products for use in such applications do so at their own risk and agree to fully indemnify
Winbond for any damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document
and the products and services described herein at any time, without notice.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q32BVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 32M-BIT, 4KB UNIFORM |
| W25Q32BVSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVTCAG | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVTCAP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVTCIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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