参数资料
型号: W25Q32BVZEAG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 8 X 6 MM, GREEN, WSON-8
文件页数: 21/79页
文件大小: 1090K
代理商: W25Q32BVZEAG
W25Q32BV
- 28 -
7.2.11 Fast Read (0Bh)
The Fast Read instruction is similar to the Read Data instruction except that it can operate at the highest
possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight
“dummy” clocks after the 24-bit address as shown in Figure 10. The dummy clocks allow the devices
internal circuits additional time for setting up the initial address. During the dummy clocks the data value
on the DO pin is a “don’t care”.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (0Bh)
High Impedance
8
9
10
28
29
30
31
24-Bit Address
23
22
21
3
2
1
0
Data Out 1
0
DO
(IO
1)
*
/CS
CLK
DI
(IO )
32
33
34
35
36
37
38
39
Dummy Clocks
40
41
42
44
45
46
47
48
49
50
51
52
53
54
55
High Impedance
7
6
5
4
3
2
1
0
7
Data Out 2
*
7
6
5
4
3
2
1
0
*
43
31
0
= MSB
*
Figure 10. Fast Read Instruction Sequence Diagram
相关PDF资料
PDF描述
W3EG6466S335AD4M 64M X 64 DDR DRAM MODULE, 0.7 ns, DMA200
W3EG7264S335AD4SG 64M X 72 DDR DRAM MODULE, 0.7 ns, DMA200
WF1M32B-120G2UI3A 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CQFP68
WF1M32B-120H1I3A 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CPGA66
WE128K32N-150G2TC 128K X 32 EEPROM 5V MODULE, 125 ns, CQFP68
相关代理商/技术参数
参数描述
W25Q32BVZEAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZEIG 制造商:Winbond Electronics Corp 功能描述:32MB SPI FLASH
W25Q32BVZEIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZPAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZPAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI