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参数资料
型号： W25Q32BVZEAG
厂商： WINBOND ELECTRONICS CORP
元件分类： PROM
英文描述： 32M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装： 8 X 6 MM, GREEN, WSON-8
文件页数： 34/79页
文件大小： 1090K
代理商： W25Q32BVZEAG
W25Q32BV
7.2.38
Program Security Registers (42h) ......................................................................................61
- 4 -
7.2.39
Read Security Registers (48h) ...........................................................................................62
8.
ELECTRICAL CHARACTERISTICS............................................................................................... 63
8.1
Absolute Maximum Ratings................................................................................................ 63
8.2
Operating Ranges............................................................................................................... 63
8.3
Power-up Timing and Write Inhibit Threshold .................................................................... 64
8.4
DC Electrical Characteristics .............................................................................................. 65
8.5
AC Measurement Conditions.............................................................................................. 66
8.6
AC Electrical Characteristics .............................................................................................. 67
8.7
AC Electrical Characteristics (cont’d) ................................................................................. 68
8.8
Serial Output Timing........................................................................................................... 69
8.9
Serial Input Timing.............................................................................................................. 69
8.10
/HOLD Timing..................................................................................................................... 69
8.11
/WP Timing......................................................................................................................... 69
9.
PACKAGE SPECIFICATION .......................................................................................................... 70
9.1
8-Pin SOIC 208-mil (Package Code SS)............................................................................ 70
9.2
8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 71
9.3
8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 72
9.4
8-Pad WSON 8x6mm (Package Code ZE) ........................................................................ 74
9.5
16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 75
9.6
24-Ball TFBGA 8x6-mm (Package Code TC) .................................................................... 76
10.
ORDERING INFORMATION .......................................................................................................... 77
10.1
Valid Part Numbers and Top Side Marking ........................................................................ 78
11.
REVISION HISTORY...................................................................................................................... 79
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相关代理商/技术参数
参数描述
W25Q32BVZEAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZEIG 制造商:Winbond Electronics Corp 功能描述:32MB SPI FLASH
W25Q32BVZEIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZPAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZPAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
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