参数资料
型号: W25Q32DWSFIG
厂商: Winbond Electronics
文件页数: 35/82页
文件大小: 0K
描述: IC FLASH SPI 32MBIT 16SOIC
标准包装: 44
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 32M(4M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC
包装: 管件
W25Q32DW
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
CLK
Mode 0
A23-16
A15-8
A7-0
M7-0
Dummy
Dummy
IOs switch from
Input to Output
IO 0
IO 1
IO 2
IO 3
20
21
22
23
16
17
18
19
12
13
14
15
8
9
10
11
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Byte 1
Byte 2
Byte 3
Figure 15b. Fast Read Quad I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode)
Fast Read Quad I/O with “8/16/32/64-Byte Wrap Around” in Standard SPI mode
The Fast Read Quad I/O instruction can also be used to access a specific portion within a page by issuing
a “Set Burst with Wrap” (77h) command prior to EBh. The “Set Burst with Wrap” (77h) command can
either enable or disable the “Wrap Around” feature for the following EBh commands. When “Wrap
Around” is enabled, the data being accessed can be limited to either a 8, 16, 32 or 64-byte section of a
256-byte page. The output data starts at the initial address specified in the instruction, once it reaches the
ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary
automatically until /CS is pulled high to terminate the command.
The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then
fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read
commands.
The “Set Burst with Wrap” instruction allows three “Wrap Bits”, W6-4 to be set. The W4 bit is used to
enable or disable the “Wrap Around” operation while W6-5 are used to specify the length of the wrap
around section within a page. See 10.2.19 for detail descriptions.
Publication Release Date: September 18, 2012
- 35 -
Revision D
相关PDF资料
PDF描述
A42MX36-BG272 IC FPGA MX SGL CHIP 54K 272-PBGA
M1AFS600-1FG256K IC FPGA 4MB FLASH 600K 256-FBGA
A3PE3000L-FG896 IC FPGA 1KB FLASH 3M 896-FBGA
ACB45DHBN CONN EDGECARD 90POS R/A .050 DIP
M1A3PE3000L-FG896 IC FPGA 1KB FLASH 3M 896-FBGA
相关代理商/技术参数
参数描述
W25Q32DWSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWSSIG 功能描述:IC FLASH SPI 32MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q32DWSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWZEIG 功能描述:IC FLASH SPI 32MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP(0.465",11.8mm 宽) 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8
W25Q32DWZEIG TR 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8WSON