参数资料
型号: W25Q80BVSNAP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 73/75页
文件大小: 1055K
代理商: W25Q80BVSNAP
W25Q80BV
Publication Release Date: October 06, 2010
- 75 -
Revision D
13. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
03/26/09
New Create Preliminary
B
08/20/09
5~8, 45 & 46,
65~71
53
Removed SOIC-16 package
Added PDIP-8 package
Updated package diagrams
Updated Suspend/Resume description
Corrected UID waveform
C
07/08/10
50, 54
63, 66
68-71
5, 9, 20, 55-57
5, 73 & 74
Corrected 90h & 9Fh diagrams
Updated AC/DC parameters
Updated package dimensions
Added SFDP feature
Added automotive temperature
D
10/06/10
All
45
Removed Preliminary designator
Updated diagrams
Updated Suspend description
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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相关代理商/技术参数
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