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参数资料
| 型号： | W25Q80BVSNIP |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 8M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| 封装： | 0.150 INCH, GREEN, PLASTIC, SOIC-8 |
| 文件页数： | 22/75页 |
| 文件大小： | 1055K |
| 代理商： | W25Q80BVSNIP |
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W25Q80BV
Publication Release Date: October 06, 2010
- 29 -
Revision D
9.2.14 Fast Read Dual I/O (BBh)
The Fast Read Dual I/O (BBh) instruction allows for improved random access while maintaining two IO
pins, IO0 and IO1. It is similar to the Fast Read Dual Output (3Bh) instruction but with the capability to
input the Address bits (A23-0) two bits per clock. This reduced instruction overhead may allow for code
execution (XIP) directly from the Dual SPI in some applications.
Fast Read Dual I/O with “Continuous Read Mode”
The Fast Read Dual I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23-0), as shown in figure 13a. The
upper nibble of the (M7-4) controls the length of the next Fast Read Dual I/O instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don’t care
(“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock.
If the “Continuous Read Mode” bits M5-4 = (1,0), then the next Fast Read Dual I/O instruction (after /CS
is raised and then lowered) does not require the BBh instruction code, as shown in figure 13b. This
reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered
after /CS is asserted low. If the “Continuous Read Mode” bits M5-4 do not equal to (1,0), the next
instruction (after /CS is raised and then lowered) requires the first byte instruction code, thus returning to
normal operation. A “Continuous Read Mode” Reset instruction can also be used to reset (M7-0) before
issuing normal instructions (See 9.2.20 for detail descriptions).
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (BBh)
8
9
10
12
13
14
24
25
26
27
28
29
30
31
6
4
2
0
*
23
/CS
CLK
DI
(IO
0)
DO
(IO
1)
0
32
33
34
35
36
37
38
39
7
5
3
1
*
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
**
IOs switch from
Input to Output
6
7
22
20
18
16
23
21
19
17
14
12
10
8
15
13
11
9
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
11
15
16
17
18
20
21
22
19
23
1
A23-16
A15-8
A7-0
M7-0
Byte 1
Byte 2
Byte 3
Byte 4
= MSB
*
Figure 13a. Fast Read Dual I/O Instruction Sequence (Initial instruction or previous M5-4
≠ 10)
相关PDF资料 |
PDF描述 |
|---|---|
| W25X10AVDIAZ | 128K X 8 FLASH 2.7V PROM, PDIP8 |
| W25X16AVDAIG | 2M X 8 FLASH 2.7V PROM, PDIP8 |
| W25X16BVZPIG | 256K X 16 FLASH 2.7V PROM, PDSO8 |
| W25X20BLSNIG | 2M X 1 FLASH 2.7V PROM, PDSO8 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q80BVSSAG | 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BVSSAP | 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BVSSIG | 功能描述:IC FLASH 8MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G（256M x 16） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6 |
| W25Q80BVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 8M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 8MBIT 104MHZ 8SOIC |
| W25Q80BVSSIG/REELS | 制造商:Winbond Electronics Corp 功能描述: |
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