参数资料
型号: W25Q80BVSNIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 8M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 70/75页
文件大小: 1055K
代理商: W25Q80BVSNIP
W25Q80BV
- 72 -
8-Pad WSON 6x5mm Cont’d.
MILLIMETERS
INCHES
SYMBOL
Min
Nom
Max
Min
Nom
Max
SOLDER PATTERN
M
3.40
0.134
N
4.30
0.169
P
6.00
0.236
Q
0.50
0.020
R
0.75
0.026
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
相关PDF资料
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W25X10AVDIAZ 128K X 8 FLASH 2.7V PROM, PDIP8
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