参数资料
型号: W25X40AVDIAZ
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 512K X 8 FLASH 2.7V PROM, PDIP8
封装: GREEN, PLASTIC, PDIP-8
文件页数: 18/45页
文件大小: 1505K
代理商: W25X40AVDIAZ
W25X10A, W25X20A, W25X40A, W25X80A
Publication Release Date: November 25, 2008
- 25 -
Revision E
10.2.13 Chip Erase (C7h or 60h)
The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A
Write Enable instruction must be executed before the device will accept the Chip Erase Instruction
(Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and
shifting the instruction code “C7h” or “60h”. The Chip Erase instruction sequence is shown in figure
14.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Chip
Erase instruction will not be executed. After /CS is driven high, the self-timed Chip Erase instruction
will commence for a time duration of tCE (See AC Characteristics). While the Chip Erase cycle is in
progress, the Read Status Register instruction may still be accessed to check the status of the BUSY
bit. The BUSY bit is a 1 during the Chip Erase cycle and becomes a 0 when finished and the device is
ready to accept other instructions again. After the Chip Erase cycle has finished the Write Enable
Latch (WEL) bit in the Status Register is cleared to 0. The Chip Erase instruction will not be executed
if any page is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register Memory
Protection table).
Figure 14. Chip Erase Instruction Sequence Diagram
相关PDF资料
PDF描述
W7NCF08GH10CS2CM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CS3FM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CSA3BM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CSA4EM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10IS7BM1G FLASH 3.3V PROM MODULE, XMA50
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