参数资料
型号: W25X40AVDIAZ
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 512K X 8 FLASH 2.7V PROM, PDIP8
封装: GREEN, PLASTIC, PDIP-8
文件页数: 6/45页
文件大小: 1505K
代理商: W25X40AVDIAZ
W25X10A, W25X20A, W25X40A, W25X80A
- 14 -
10.2 INSTRUCTIONS
The instruction set of the W25X10A/20A/40A/80A consists of fifteen basic instructions that are fully
controlled through the SPI bus (see Instruction Set table). Instructions are initiated with the falling
edge of Chip Select (/CS). The first byte of data clocked into the DIO input provides the instruction
code. Data on the DIO input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes,
data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed
with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in
figures 4 through 19. All read instructions can be completed after any clocked bit. However, all
instructions that Write, Program or Erase must complete on a byte boundary (CS driven high after a
full 8-bits have been clocked) otherwise the instruction will be terminated. This feature further protects
the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or
when the Status Register is being written, all instructions except for Read Status Register will be
ignored until the program or erase cycle has completed.
10.2.1 Manufacturer and Device Identification
MANUFACTURER ID
(M7-M0)
Winbond Serial Flash
EFh
Device ID
(ID7-ID0)
(ID15-ID0)
Instruction
ABh, 90h
9Fh
W25X10A
10h
3011h
W25X20A
11h
3012h
W25X40A
12h
3013h
W25X80A
13h
3014h
相关PDF资料
PDF描述
W7NCF08GH10CS2CM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CS3FM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CSA3BM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CSA4EM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10IS7BM1G FLASH 3.3V PROM MODULE, XMA50
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