参数资料
型号: W25X40AVDIAZ
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 512K X 8 FLASH 2.7V PROM, PDIP8
封装: GREEN, PLASTIC, PDIP-8
文件页数: 22/45页
文件大小: 1505K
代理商: W25X40AVDIAZ
W25X10A, W25X20A, W25X40A, W25X80A
Publication Release Date: November 25, 2008
- 29 -
Revision E
10.2.16 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down/
Device ID instruction that provides both JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 18. The Device ID values for the W25X10A, W25X20A, W25X40A and W25X80A
are listed in Manufacturer and Device Identification table. If the 24-bit address is initially set to
000001h the Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer
and Device IDs can be read continuously, alternating from one to the other. The instruction is
completed by driving /CS high.
Figure 18. Read Manufacturer / Device ID Diagram
相关PDF资料
PDF描述
W7NCF08GH10CS2CM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CS3FM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CSA3BM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10CSA4EM1G FLASH 3.3V PROM MODULE, XMA50
W7NCF08GH10IS7BM1G FLASH 3.3V PROM MODULE, XMA50
相关代理商/技术参数
参数描述
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