参数资料
型号: W25X64VSFIG
厂商: Winbond Electronics
文件页数: 3/50页
文件大小: 0K
描述: IC FLASH 64MBIT 75MHZ 16SOIC
标准包装: 44
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 75MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC
包装: 管件
W25X16, W25X16A, W25X32, W25X64
12.2.2
12.2.3
12.2.4
12.2.5
12.2.6
12.2.7
12.2.8
12.2.9
12.2.10
12.2.11
12.2.12
12.2.13
12.2.14
12.2.15
12.2.16
12.2.17
Instruction Set...............................................................................................................17
Write Enable (06h)........................................................................................................18
Write Disable (04h).......................................................................................................18
Read Status Register (05h) ..........................................................................................19
Write Status Register (01h) ..........................................................................................20
Read Data (03h) ...........................................................................................................21
Fast Read (0Bh) ...........................................................................................................22
Fast Read Dual Output (3Bh) .......................................................................................23
Page Program (02h) ...................................................................................................24
Sector Erase (20h) .....................................................................................................25
Block Erase (D8h) ......................................................................................................26
Chip Erase (C7h)........................................................................................................27
Power-down (B9h) ......................................................................................................28
Release Power-down / Device ID (ABh) .....................................................................29
Read Manufacturer / Device ID (90h) .........................................................................31
JEDEC ID (9Fh)..........................................................................................................32
13.
ELECTRICAL CHARACTERISTICS......................................................................................... 33
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
13.10
Absolute Maximum Ratings .......................................................................................... 33
Operating Ranges......................................................................................................... 33
Endurance and Data Retention .................................................................................... 34
Power-up Timing and Write Inhibit Threshold .............................................................. 34
DC Electrical Characteristics ........................................................................................ 35
AC Measurement Conditions........................................................................................ 36
AC Electrical Characteristics ........................................................................................ 37
Serial Output Timing ..................................................................................................... 39
Input Timing .................................................................................................................. 39
Hold Timing ................................................................................................................. 39
14.
PACKAGE SPECIFICATION .................................................................................................... 40
14.1
14.2
14.3
14.4
14.5
14.6
8-Pin SOIC 150-mil (Package Code SN)...................................................................... 40
8-Pin SOIC 208-mil (Package Code SS)...................................................................... 41
8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 42
8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 43
8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 45
16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 46
15.
16.
ORDERING INFORMATION .................................................................................................... 47
REVISION HISTORY ................................................................................................................ 49
Publication Release Date: may 5, 2008
-3-
Revision I
相关PDF资料
PDF描述
R2D-1515/HP-R CONV DC/DC 2W 15VIN +/-15VOUT
TAJA105K035RNJ CAP TANT 1UF 35V 10% 1206
ABC35DREF-S734 CONN EDGECARD 70POS .100 EYELET
R2D-1512/HP-R CONV DC/DC 2W 15VIN +/-12VOUT
VE-J0T-IZ CONVERTER MOD DC/DC 6.5V 25W
相关代理商/技术参数
参数描述
W25X64VSFIZ 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X64VSSI 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X64VSSIG 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X64VSSIZ 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
W25X64VZEI 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI