参数资料
型号: W25X64VSFIG
厂商: Winbond Electronics
文件页数: 32/50页
文件大小: 0K
描述: IC FLASH 64MBIT 75MHZ 16SOIC
标准包装: 44
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 75MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC
包装: 管件
W25X16, W25X16A, W25X32, W25X64
12.2.17 JEDEC ID (9Fh)
For compatibility reasons, the W25X16/16A/32/64 provides several instructions to electronically
determine the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC
standard for SPI compatible serial memories that was adopted in 2003.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The
JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type
(ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant
bit (MSB) first as shown in figure 19. For memory type and capacity values refer to Manufacturer and
Device Identification table.
Figure 19. Read JEDEC ID
- 32 -
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