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参数资料
| 型号： | W25X64VZEIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 3/50页 |
| 文件大小： | 0K |
| 描述： | IC FLASH 64MBIT 75MHZ 8WSON |
| 标准包装： | 63 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 64M（8M x 8） |
| 速度： | 75MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-WDFN 裸露焊盘 |
| 供应商设备封装： | 8-WSON（8x6） |
| 包装： | 管件 |
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W25X16, W25X16A, W25X32, W25X64
12.2.2
12.2.3
12.2.4
12.2.5
12.2.6
12.2.7
12.2.8
12.2.9
12.2.10
12.2.11
12.2.12
12.2.13
12.2.14
12.2.15
12.2.16
12.2.17
Instruction Set...............................................................................................................17
Write Enable (06h)........................................................................................................18
Write Disable (04h).......................................................................................................18
Read Status Register (05h) ..........................................................................................19
Write Status Register (01h) ..........................................................................................20
Read Data (03h) ...........................................................................................................21
Fast Read (0Bh) ...........................................................................................................22
Fast Read Dual Output (3Bh) .......................................................................................23
Page Program (02h) ...................................................................................................24
Sector Erase (20h) .....................................................................................................25
Block Erase (D8h) ......................................................................................................26
Chip Erase (C7h)........................................................................................................27
Power-down (B9h) ......................................................................................................28
Release Power-down / Device ID (ABh) .....................................................................29
Read Manufacturer / Device ID (90h) .........................................................................31
JEDEC ID (9Fh)..........................................................................................................32
13.
ELECTRICAL CHARACTERISTICS......................................................................................... 33
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
13.10
Absolute Maximum Ratings .......................................................................................... 33
Operating Ranges......................................................................................................... 33
Endurance and Data Retention .................................................................................... 34
Power-up Timing and Write Inhibit Threshold .............................................................. 34
DC Electrical Characteristics ........................................................................................ 35
AC Measurement Conditions........................................................................................ 36
AC Electrical Characteristics ........................................................................................ 37
Serial Output Timing ..................................................................................................... 39
Input Timing .................................................................................................................. 39
Hold Timing ................................................................................................................. 39
14.
PACKAGE SPECIFICATION .................................................................................................... 40
14.1
14.2
14.3
14.4
14.5
14.6
8-Pin SOIC 150-mil (Package Code SN)...................................................................... 40
8-Pin SOIC 208-mil (Package Code SS)...................................................................... 41
8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 42
8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 43
8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 45
16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 46
15.
16.
ORDERING INFORMATION .................................................................................................... 47
REVISION HISTORY ................................................................................................................ 49
Publication Release Date: may 5, 2008
-3-
Revision I
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25X64VZEIZ | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X64VZPI | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X64VZPIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X64VZPIZ | 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X80 | 制造商:WINBOND 制造商全称:Winbond 功能描述:The W25X10 (1M-bit), W25X20 (2M-bit), W25X40 (4M-bit) and W25X80 (8M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. |
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