参数资料
型号: W332M64V-100SBI
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: DRAM
英文描述: 32M X 64 SYNCHRONOUS DRAM, 7 ns, PBGA208
封装: 13 X 22 MM, PLASTIC, BGA-208
文件页数: 7/15页
文件大小: 355K
代理商: W332M64V-100SBI
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W332M64V-XSBX
August 2007
Rev. 4
Document Title
32M x 64 SDRAM Multi-Chip Package, 13mm x 22mm
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
October 2004
Advanced
Rev 1
Changes (Pg. 1, 9, 13, 15)
1.1 Change status to Preliminary
1.2 PNC#04019 – Change max thickness of package body to
2.56mm
1.3 Change max storage temperature to 125°C
1.4 Change typical weight to 1.5g
1.5 Add thermal resistance values
May 2005
Preliminary
Rev. 2
Rev.3
Rev.4
Changes (Pg. 1, 10, 15)
2.1 Update input leakage address current
2.2 Update ICC1, ICC3, ICC4 and ICC7
Changes (Pg. 1-15)
3.1 Change status to Final
3.2 Add 133MHz operation charcteristics
Changes (Pg. 1, 13, 15)
4.1 Update package thickness to 2.27mm
August 2005
September 2005
August 2007
Preliminary
Final
相关PDF资料
PDF描述
W332M64V-125SBC 32M X 64 SYNCHRONOUS DRAM, 6 ns, PBGA208
W332M64V-133SBC 32M X 64 SYNCHRONOUS DRAM, 5.5 ns, PBGA208
W332M64V-125SBM 32M X 64 SYNCHRONOUS DRAM, 6 ns, PBGA208
W332M72V-133BM 32M X 72 SYNCHRONOUS DRAM, 5.5 ns, PBGA219
W332M72V-133BI 32M X 72 SYNCHRONOUS DRAM, 5.5 ns, PBGA219
相关代理商/技术参数
参数描述
W332M64V-100SBM 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 100MHZ, 208 PBGA, MIL-TEMP. - Bulk
W332M64V-125BC 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 125MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk
W332M64V-125BI 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 125MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk
W332M64V-125BM 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 125MHZ, 219 PBGA, MIL-TEMP. - Bulk
W332M64V-125SBC 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 125MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk