参数资料
型号: W3E32M72S-200BC
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: 32M X 72 DDR DRAM, 0.8 ns, PBGA219
封装: 32 X 25 MM, PLASTIC, BGA-219
文件页数: 10/19页
文件大小: 739K
代理商: W3E32M72S-200BC
W3E32M72S-XBX
18
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
March 2006
Rev. 2
White Electronic Designs Corp. reserves the right to change products or specications without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 32M x 72
2.5V Power Supply
DATA RATE (Mbs/MHz)
200 = 200Mbs/100mHz
250 = 250Mbs/125mHz
266 = 266Mbs/133mHz
333 = 333Mbs/166mHz
PACKAGE:
B = 219 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W 3E 32M 72 S - XXX B X
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相关代理商/技术参数
参数描述
W3E32M72S-200BI 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk
W3E32M72S-200BM 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 219 PBGA, MIL-TEMP. - Bulk
W3E32M72S-200SBC 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk
W3E32M72S-200SBI 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 208 PBGA, INDUSTRIAL TEMP. - Bulk
W3E32M72S-200SBM 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 208 PBGA, MIL-TEMP. - Bulk