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参数资料
| 型号： | W3E32M72S-200BC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 32M X 72 DDR DRAM, 0.8 ns, PBGA219 |
| 封装： | 32 X 25 MM, PLASTIC, BGA-219 |
| 文件页数： | 11/19页 |
| 文件大小： | 739K |
| 代理商： | W3E32M72S-200BC |
W3E32M72S-XBX
19
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
March 2006
Rev. 2
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
32M x 72 DDR SDRAM, 219 PBGA Multi-Chip Package, 25mm x 32mm
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
May 2004
Advanced
Rev 1
Changes (Pg. 1, 10, 18, 19)
1.1 Update capacitance table values
1.2 Update thermal resistance table values
1.3 Change max storage temperature to 125°C
1.4 Change package typical weight to 3.0g.
January 2005
Final
Rev 2
Changes (Pg. All)
2.1 All 333Mbs option
March 2006
Final
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E32M72S-200BI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M72S-200BM | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M72S-200SBC | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M72S-200SBI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 208 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M72S-200SBM | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 200 MHZ, 208 PBGA, MIL-TEMP. - Bulk |
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