参数资料
型号: W3E32M72S-200SBM
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: 32M X 72 DDR DRAM, 0.8 ns, PBGA208
封装: 16 X 22 MM, PLASTIC, BGA-208
文件页数: 10/19页
文件大小: 373K
代理商: W3E32M72S-200SBM
W3E32M72S-XSBX
18
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
August 2007
Rev. 7
White Electronic Designs Corp. reserves the right to change products or specications without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 32M x 72
2.5V POWER SUPPLY
DATA RATE (Mbs/MHz)
200 = 200Mbs/100MHz
250 = 250Mbs/125MHz
266 = 266Mbs/133MHz
333 = 333Mbs/166MHz
PACKAGE:
SB = 208 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W 3E 32M 72 S - XXX SB X
相关PDF资料
PDF描述
W3E32M72S-333SBM 32M X 72 DDR DRAM, 0.7 ns, PBGA208
W3E32M72S-333BI 32M X 72 DDR DRAM, 0.7 ns, PBGA219
W3E32M72S-250BM 32M X 72 DDR DRAM, 0.8 ns, PBGA219
W3E32M72S-333BC 32M X 72 DDR DRAM, 0.7 ns, PBGA219
W3E32M72S-250BC 32M X 72 DDR DRAM, 0.8 ns, PBGA219
相关代理商/技术参数
参数描述
W3E32M72S-250BC 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk
W3E32M72S-250BI 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk
W3E32M72S-250BM 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 219 PBGA, MIL-TEMP. - Bulk
W3E32M72S-250SBC 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk
W3E32M72S-250SBI 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 208 PBGA, INDUSTRIAL TEMP. - Bulk