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参数资料
| 型号： | W3E32M72S-200SBM |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 32M X 72 DDR DRAM, 0.8 ns, PBGA208 |
| 封装： | 16 X 22 MM, PLASTIC, BGA-208 |
| 文件页数： | 9/19页 |
| 文件大小： | 373K |
| 代理商： | W3E32M72S-200SBM |
W3E32M72S-XSBX
17
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
August 2007
Rev. 7
White Electronic Designs Corp. reserves the right to change products or specications without notice.
All linear dimensions are millimeters and parenthetically in inches
BOTTOM VIEW
PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA)
3.20 (0.126) MAX
0.5 (0.020) NOM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
11 10 9
8
7
6
5
4
3
2
1
208 x 0.51 (0.020) NOM
1.0 (0.039)NOM
10.0 (0.394) NOM
16.15 (0.636) MAX
22.15
(0.872)
MAX
18.0
(0.709)
NOM
1.0
(0.039)
NOM
Note: This package utilizes solder balls which contain lead, Sn 63Pb37; if you require a lead-free solder ball package, please contact WEDC for information.
相关PDF资料 |
PDF描述 |
|---|---|
| W3E32M72S-333SBM | 32M X 72 DDR DRAM, 0.7 ns, PBGA208 |
| W3E32M72S-333BI | 32M X 72 DDR DRAM, 0.7 ns, PBGA219 |
| W3E32M72S-250BM | 32M X 72 DDR DRAM, 0.8 ns, PBGA219 |
| W3E32M72S-333BC | 32M X 72 DDR DRAM, 0.7 ns, PBGA219 |
| W3E32M72S-250BC | 32M X 72 DDR DRAM, 0.8 ns, PBGA219 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E32M72S-250BC | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M72S-250BI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M72S-250BM | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M72S-250SBC | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M72S-250SBI | 制造商:Microsemi Corporation 功能描述:32M X 72 DDR, 2.5V, 250 MHZ, 208 PBGA, INDUSTRIAL TEMP. - Bulk |
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