参数资料
型号: W3HG128M72AEF665F1MCG
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: DDR DRAM MODULE, DMA240
封装: ROHS COMPLIANT, FBDIMM-240
文件页数: 1/17页
文件大小: 256K
代理商: W3HG128M72AEF665F1MCG
W3HG128M72AEF-Fx
September 2007
Rev. 3
ADVANCED*
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
1GB – 128Mx72 DDR2 SDRAM FBDIMM, ECC
VCC = VCCQ = +1.8V for DDR2 SDRAM
VREF = 0.9V SDRAM C/A termination
VCC = 1.5V for advanced memory buffer (AMB)
Serial Presence Detect (SPD) with EEPROM
Gold edge contacts
Dual rank
RoHS
DESCRIPTION
The W3HG128M72AEF is a 128Mx72 fully buffered 240-
pin Double Data Rate 2 SDRAM memory module based
on 512Mb DDR2 SDRAM components. The module
consists of eighteen 128Mx4, in FBGA package and a
AMB mounted on a 240 pin FR4 substrate.
* This product is under development, is not qualied or characterized and is subject to
change or cancellation without notice.
NOTE: Consult factory for availability of:
Vendor source control options
FEATURES
240-pin DDR2 fully buffered, dual in-line memory
module (FBDIMM) with ECC to detect and report
channel errors to the host memory controller.
Fast DDR2 DRAM data transfer rates: PC2-6400*,
PC2-5300, and PC2-4300
3.2 Gb/s and 4.0 Gb link transfer rates
High speed differential point-to-point link between
host memory controller and the AMB using serial,
dual-simplex bit lanes
10-pair southbound (data path to FBDIMM)
14-pair northbound (data path to FBDIMM)
Fault tolerant; can work around a bad bit lane in
each direction
High density scaling with up to 8 dual-rank modules
(288 DDR2 SDRAM devices) per channel
SMBus interface to AMB for conguration register
access.
In-band and out-bank command access
Deterministic protocol
Enables memory controller to optimize DRAM
access for maximum performance
Delivers precise control and repeatable memory
behavior
Automatic DDR2 SDRAM bus and channel
calibration
Transmitter de-emphasis to reduce ISI
MBIST and IBIST test functions
Transparent mode for DDR2 SDRAM test support
PERFORMANCE PARAMETERS
Speed Grade
Module Bandwidth
Peak Channel Throughput
Link Transfer Rate
Latency (CL-tRCD-tRP)
665
PC2-5300
8.0 GB/s
4.0 GT/s
5-5-5
534
PC2-4200
6.4 GB/s
3.2 GT/s
4-4-4
* Consult factory for availability
Note: JEDEC has not yet adopted a nal FBDIMM standard
相关PDF资料
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