参数资料
型号: W72M64VB100BI
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: 存储器
英文描述: SPECIALTY MEMORY CIRCUIT, PBGA159
封装: 13 X 22 MM, PLASTIC, BGA-159
文件页数: 1/16页
文件大小: 660K
代理商: W72M64VB100BI
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W72M64VB-XBX
June 2009
Rev. 2
2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
Access Times of 90, 100, 120ns
Packaging
159 PBGA, 13x22mm - 1.27mm pitch
1,000,000 Erase/Program Cycles
Sector Architecture
Eight - 8Kbyte sectors
Sixty three 64-Kbyte sectors
Bottom boot block
Organized as 2Mx64 or 2x2Mx32
Commercial, Industrial and Military Temperature
Ranges
3.3 Volt for Read and Write Operations
Erase Suspend/Resume
Suspends erase operations to allow programming
in same bank
Data# Polling and Toggle Bits
Provides a software method of detecting the
status of program or erase cycles
Unlock Bypass Program command
Reduces overall programming time when issuing
multiple program command sequences
Ready/Busy# output (RY/BY#)
Hardware method for detecting program or erase
cycle completion
Hardware reset pin (RESET#)
Hardware method of reset the device to reading
array data
WP#/ACC input pin
Write protect (WP#) function allows protection
two outermost boot sectors, regardless of sector
protect status
Acceleration (ACC) function accelerates program
timing
Sector Protection
Hardware method of locking a sector, either
in-system or using programming equipment, to
prevent any program or erase operation within
that sector
Temporary Sector Unprotect allows changing
data in protected sectors in-system
Sector can be locked in-system or via
programming equipment
Note: For programming information refer to Flash Programming
W72M64VB-XBX Application Note.
* This product is subject to change without notice.
FEATURES
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W7NCF01GH31CS2CG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
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