参数资料
型号: W72M64VB100BI
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: 存储器
英文描述: SPECIALTY MEMORY CIRCUIT, PBGA159
封装: 13 X 22 MM, PLASTIC, BGA-159
文件页数: 7/16页
文件大小: 660K
代理商: W72M64VB100BI
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W72M64VB-XBX
June 2009
Rev. 2
PACKAGE: 159 PBGA
WHITE ELECTRONIC DESIGNS CORP.:
Flash:
Organization, 2M x 64:
User Congurable as 2 x 2M x 32
3.3V Power Supply:
Internal Bank Architecture:
B = Bottom boot block
Access Time (ns):
90 = 90ns
100 = 100ns
120 = 120ns
Package Type:
B = 159 Plastic BGA, 13mm x 22mm
Device Grade:
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
W 7 2M64 V B XXX B X
相关PDF资料
PDF描述
W7NCF01GH31CS2CG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF01GH31IS2JG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF01GH31IS5CG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF01GH31IS9CG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF08GH21IS3FG 512M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
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