参数资料
型号: W764M32V100SBI
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: PROM
英文描述: 64M X 32 FLASH 3V PROM, 100 ns, PBGA107
封装: 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107
文件页数: 15/16页
文件大小: 511K
代理商: W764M32V100SBI
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W764M32V-XSBX
June 2009
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
AC CHARACTERISTICS – HARDWARE RESET (RESET#)
Parameter
Symbol
Unit
Min
Max
RESET# Pin Low (During Embedded Algorithms)
to Read Mode (1)
tready
20
μs
RESET# Pin Low (NOT During Embedded Algorithms)
to Read Mode (1)
tready
500
ns
RESET# Pulse Width
tRP
500
ns
RESET# High Time Before Read (1)
tRH
50
ns
RESET# Low to Standby Mode (1)
tRPD
20
μs
RY/BY# Recovery Time
tRB
0ns
NOTE: 1. Not tested.
RY/BY#
CS#, OE#
RESET#
tRP
tReady
tRH
tReady
tRP
tRH
tRB
RY/BY#
CS#, OE#
RESET#
FIGURE 4: RESET TIMINGS NOT DURING EMBEDDED ALGORITHMS
FIGURE 5: RESET TIMINGS DURING EMBEDDED ALGORITHMS
相关PDF资料
PDF描述
W25Q16CLSSIG 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q40BWUXIG 4M X 1 SPI BUS SERIAL EEPROM, PDSO8
WF128K32NA-200HM 512K X 8 FLASH 12V PROM MODULE, 200 ns, CHIP66
WS512K32N-45HI 2M X 8 MULTI DEVICE SRAM MODULE, 45 ns, CHIP66
WF128K32-70G4M5 512K X 8 FLASH 5V PROM MODULE, 70 ns, CQFP68
相关代理商/技术参数
参数描述
W764M32V100SBI/T/R-C50700 制造商:Microsemi Corporation 功能描述:LOCKHEE DIE - Gel-pak, waffle pack, wafer, diced wafer on film
W764M32V100SBM 制造商:Microsemi Corporation 功能描述:MICROCIRCUIT, MEMORY, FLASH, 64M X 32 - Bulk
W764M32V120SB 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory
W764M32V120SBC 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory
W764M32V120SBI 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory