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参数资料
| 型号： | W764M32V100SBI |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | PROM |
| 英文描述： | 64M X 32 FLASH 3V PROM, 100 ns, PBGA107 |
| 封装： | 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107 |
| 文件页数： | 5/16页 |
| 文件大小： | 511K |
| 代理商： | W764M32V100SBI |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W764M32V-XSBX
June 2009
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
AC CHARACTERISTICS – ALTERNATE CS# CONTROLLED ERASE AND PROGRAM OPERATIONS
Parameter
Description
Speed Options
Unit
JEDEC
Std
100
120
tAVAV
tWC
Write Cycle Time (1)
Min
100
120
ns
tAVWL
tAS
Address Setup Time
Min
0
ns
tELAX
tAH
Address Hold Time
Min
45
50
ns
tDVEH
tDS
Data Setup Time
Min
45
50
ns
tEHDX
tDH
Data Hold Time
Min
0
ns
tGHEL
Read Recovery Time Before Write (OE# High to WE# Low)
Min
0
ns
tWLEL
TWS
WE# Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time
Min
0
ns
tELEH
tCP
CS# Pulse Width
Min
35
ns
tEHEL
tCPH
CS# Pulse Width High
Min
30
ns
tWHWH1
Programming Operation
Typ
60
6
μs
tWHWH1
Accelerated Programming Operation
Typ
54
μs
tWHWH2
Sector Erase Operation
Typ
0.5
05
sec
NOTE: 1. Not tested.
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相关代理商/技术参数 |
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|---|---|
| W764M32V100SBI/T/R-C50700 | 制造商:Microsemi Corporation 功能描述:LOCKHEE DIE - Gel-pak, waffle pack, wafer, diced wafer on film |
| W764M32V100SBM | 制造商:Microsemi Corporation 功能描述:MICROCIRCUIT, MEMORY, FLASH, 64M X 32 - Bulk |
| W764M32V120SB | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V120SBC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V120SBI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
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