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参数资料
| 型号： | W764M32V100SBI |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | PROM |
| 英文描述： | 64M X 32 FLASH 3V PROM, 100 ns, PBGA107 |
| 封装： | 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107 |
| 文件页数： | 16/16页 |
| 文件大小： | 511K |
| 代理商： | W764M32V100SBI |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W764M32V-XSBX
June 2009
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
FIGURE 6: PROGRAM OPERATIONS
Addresses
CS#
OE#
WE#
Data
RY/BY#
VCC
555h
PA
tWC
tAH
tWHWH1
PD
Status
DOUT
A0h
tBUSY
PA
tAS
tCH
tWP
tCS
tWPH
tDS
tDH
tVCS
tRB
NOTES:
1.
PA is the address of the memory location to be programmed.
2.
PD is the data to be programmed at byte address.
3.
DOUT is the output of the data written to the device.
4.
Figure indicates last two bus cycles of four bus cycle sequence.
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相关代理商/技术参数 |
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| W764M32V100SBI/T/R-C50700 | 制造商:Microsemi Corporation 功能描述:LOCKHEE DIE - Gel-pak, waffle pack, wafer, diced wafer on film |
| W764M32V100SBM | 制造商:Microsemi Corporation 功能描述:MICROCIRCUIT, MEMORY, FLASH, 64M X 32 - Bulk |
| W764M32V120SB | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V120SBC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V120SBI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
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