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参数资料
| 型号： | W764M32V100SBI |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | PROM |
| 英文描述： | 64M X 32 FLASH 3V PROM, 100 ns, PBGA107 |
| 封装： | 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107 |
| 文件页数： | 4/16页 |
| 文件大小： | 511K |
| 代理商： | W764M32V100SBI |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W764M32V-XSBX
June 2009
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
FIGURE 10: TOGGLE BIT TIMINGS (DURING EMBEDDED ALGORITHMS)
FIGURE 11: DQ2 Vs. DQ6
RY/BY#
DQ6/DQ2
OE#
CS#
Addresses
WE#
tAS
tAHT
tASO
tCEPH
tOEH
tOEPH
tDH
Valid Data
Valid
Status
Valid
Data
tOE
(First Read)
(Second Read)
(Stops Toggling)
Valid
Status
Valid
Status
NOTE: VA = Valid address, not required for DQ6. Illustration shows rst two status cycle after command sequence, last status read cycle, and array data read cycle.
WE#
DQ6
DQ2
Enter
Embedded
Erasing
Erase
Suspend
Enter Erase
Suspend Program
Erase
Resume
Erase
Erase Suspend
Read
Erase
Suspend
Program
Erase Suspend
Read
Erase
Complete
NOTE: DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CS# to toggle DQ2 and DQ6.
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相关代理商/技术参数 |
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| W764M32V100SBI/T/R-C50700 | 制造商:Microsemi Corporation 功能描述:LOCKHEE DIE - Gel-pak, waffle pack, wafer, diced wafer on film |
| W764M32V100SBM | 制造商:Microsemi Corporation 功能描述:MICROCIRCUIT, MEMORY, FLASH, 64M X 32 - Bulk |
| W764M32V120SB | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V120SBC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
| W764M32V120SBI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx32 Flash Multi-Chip Package 3.0V Page Mode Flash Memory |
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