参数资料
型号: WED2ZL361MS26BC
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: SRAM
英文描述: 1M X 36 ZBT SRAM, 2.6 ns, PBGA119
封装: PLASTIC, BGA-119
文件页数: 1/12页
文件大小: 645K
代理商: WED2ZL361MS26BC
1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WED2ZL361MS
Oct, 2002
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specications without notice.
The WEDC SyncBurst - SRAM family employs high-speed,
low-power CMOS designs that are fabricated using an
advanced CMOS process. WEDC’s 32Mb SyncBurst
SRAMs integrate two 1M x 18 SRAMs into a single BGA
package to provide 1M x 36 conguration. All synchronous
inputs pass through registers controlled by a positive-
edge-triggered single-clock input (CK). The NBL or No
Bus Latency Memory utilizes all the bandwidth in any
combination of operating cycles. Address, data inputs, and
all control signals except output enable and linear burst
order are synchronized to input clock. Burst order control
must be tied “High or Low.” Asynchronous inputs include the
sleep mode enable (ZZ). Output Enable controls the outputs
at any given time. Write cycles are internally self-timed and
initiated by the rising edge of the clock input. This feature
eliminates complex off-chip write pulse generation and
provides increased timing exibility for incoming signals.
1Mx36 Synchronous Pipeline Burst NBL SRAM
BLOCK DIAGRAM
PIN CONFIGURATION
(TOP VIEW)
Address Bus
(SA0 - SA19)
DQa, DQb
DQPa, DQPb
DQc, DQd
DQPc, DQPd
DQa - DQd
DQPa - DQPd
1M x 18
CK
CKE#
ADV#
LBO#
CS1#
CS2
CS2#
OE#
WE#
ZZ
CK
CKE#
ADV#
LBO#
CE1#
CE2
CE2#
OE#
WE#
ZZ
CK
CKE#
ADV#
LBO#
CS1#
CS2
CS2#
OE#
WE#
ZZ
BWd#
BW
a#
BWc#
BWb#
Fast clock speed: 250, 225, 200, 166, 150,
133MHz
Fast access times: 2.6, 2.8, 3.0, 3.5, 3.8, 4.2ns
Fast OE# access times: 2.6, 2.8, 3.0, 3.5, 3.8,
4.2ns
Separate +2.5V ± 5% power supplies for Core, I/O
(VCC, VCCQ)
Snooze Mode for reduced-standby power
Individual Byte Write control
Clock-controlled and registered addresses, data
I/Os and control signals
Burst control (interleaved or linear burst)
Packaging:
119-bump BGA package
Low capacitive bus loading
1
2
3
4
5
6
7
A VCCQ
SA
VCCQ
B
SA
CE2
SA
ADV#
SA
CE2#
NC
C NC
SA
VCC
SA
NC
D DQc DQPc VSS
NC
VSS
DQPb DQb
E DQc DQc
VSS
CE1#
VSS
DQb DQb
F VCCQ DQc
VSS
OE#
VSS
DQb VCCQ
G DQc DQc BWc#
SA
BWb# DQb DQb
H DQc DQc
VSS
WE#
VSS
DQb DQb
J VCCQ VCC
NC
VCC
NC
VCC
VCCQ
K DQd DQd
VSS
CK
VSS
DQa DQa
L DQd DQd BWd# NC
BWa# DQa DQa
M VCCQ DQd
VSS CKE#
VSS
DQa VCCQ
N DQd DQd
VSS
SA1
VSS
DQa DQa
P DQd DQPd VSS
SA0
VSS
DQPa DQa
R NC
SA
LBO# VCC
NC
SA
NC
T NC
NC
SA
NC
ZZ
U VCCQ
NC
VCCQ
FEATURES
DESCRIPTION
NOTE: NBL (No Bus Latency) is equivalent to ZBT
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