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参数资料
| 型号： | X28HC64P-12 |
| 厂商： | Intersil |
| 文件页数： | 17/17页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 64KBIT 120NS 28DIP |
| 标准包装： | 13 |
| 格式 - 存储器： | EEPROMs - 并行 |
| 存储器类型： | EEPROM |
| 存储容量： | 64K (8K x 8) |
| 速度： | 120ns |
| 接口： | 并联 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 28-DIP（0.600"，15.24mm） |
| 供应商设备封装： | 28-PDIP |
| 包装： | 管件 |
X28HC64
Dual-In-Line Plastic Packages (PDIP)
INDEX
AREA
N
1 2 3
N/2
E1
E28.6 (JEDEC MS-011-AB ISSUE B)
28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX
NOTES
-B-
A
-
0.250
-
6.35
4
-A-
D
E
A1
0.015
-
0.39
-
4
BASE
PLANE
SEATING
PLANE
-C-
A2
L
A
CL
A2
B
B1
0.125
0.014
0.030
0.195
0.022
0.070
3.18
0.356
0.77
4.95
0.558
1.77
-
-
8
D1
B1
B
D1
e
0.010 (0.25) M
A1
e C
C A B S
e A
C
e B
C
D
D1
E
0.008
1.380
0.005
0.600
0.015
1.565
-
0.625
0.204
35.1
0.13
15.24
0.381
39.7
-
15.87
-
5
5
6
NOTES:
E1
0.485
0.580
12.32
14.73
5
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
e
e A
0.100 BSC
0.600 BSC
2.54 BSC
15.24 BSC
-
6
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS - 3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
e B
L
N
-
0.115
28
0.700
0.200
-
2.93
28
17.78
5.08
7
4
9
Rev. 1 12/00
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and e A are measured with the leads constrained to be perpendic-
ular to datum -C- .
7. e B and e C are measured at the lead tips with the leads unconstrained.
e C must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
17
FN8109.2
August 28, 2009
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