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参数资料
| 型号： | X28HC64P-12 |
| 厂商： | Intersil |
| 文件页数： | 2/17页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 64KBIT 120NS 28DIP |
| 标准包装： | 13 |
| 格式 - 存储器： | EEPROMs - 并行 |
| 存储器类型： | EEPROM |
| 存储容量： | 64K (8K x 8) |
| 速度： | 120ns |
| 接口： | 并联 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 28-DIP（0.600"，15.24mm） |
| 供应商设备封装： | 28-PDIP |
| 包装： | 管件 |
X28HC64
Ordering Information
TEMPERATURE
ACCESS TIME
PKG.
PART NUMBER
X28HC64J-70*
X28HC64JIZ-70* (Note 1)
X28HC64JZ-70* (Note 1)
X28HC64SIZ-70
X28HC64SZ-70 (Note 1)
X28HC64J-90*
X28HC64JI-90**
X28HC64JIZ-90* (Note 1)
X28HC64P-90
X28HC64PI-90
PART MARKING
X28HC64J-70 RR
X28HC64JI-70 ZRR
X28HC64J-70 ZRR
X28HC64SI-70 RR
X28HC64S-70 RRZ
X28HC64J-90 RR
X28HC64JI-90 RR
X28HC64JI-90 ZRR
X28HC64P-90 RR
X28HC64PI-90 RR
RANGE (°C)
0 to +70
-40 to +85
0 to +70
-40 to +85
0 to +70
0 to +70
-40 to +85
-40 to +85
0 to +70
-40 to +85
(ns)
70
90
PACKAGE
32 Ld PLCC
32 Ld PLCC (Pb-free)
32 Ld PLCC (Pb-free)
28 Ld SOIC (300 mil)
28 Ld SOIC (300 mil) (Pb-free)
32 Ld PLCC
32 Ld PLCC
32 Ld PLCC (Pb-free)
28 Ld PDIP
28 Ld PDIP
DWG. #
N32.45x55
N32.45x55
N32.45x55
M28.3
M28.3
N32.45x55
N32.45x55
N32.45x55
E28.6
E28.6
X28HC64PIZ-90 (Notes 1, 2) X28HC64PI-90 RRZ
X28HC64PZ-90 (Notes 1, 2) X28HC64P-90 RRZ
-40 to +85
0 to +70
28 Ld PDIP (Pb-free)
28 Ld PDIP (Pb-free)
E28.6
E28.6
X28HC64J-12*
X28HC64JI-12*
X28HC64JIZ-12* (Note 1)
X28HC64JZ-12* (Note 1)
X28HC64P-12
X28HC64PI-12
X28HC64J-12 RR
X28HC64JI-12 RR
X28HC64JI-12 Z RR
X28HC64J-12 RRZ
X28HC64P-12 RR
X28HC64PI-12 RR
0 to +70
-40 to +85
-40 to +85
0 to +70
0 to +70
-40 to +85
120
32 Ld PLCC
32 Ld PLCC
32 Ld PLCC (Pb-free)
32 Ld PLCC (Pb-free)
28 Ld PDIP
28 Ld PDIP
N32.45x55
N32.45x55
N32.45x55
N32.45x55
E28.6
E28.6
X28HC64PIZ-12 (Notes 1, 2) X28HC64PI-12 RRZ
X28HC64PZ-12 (Notes 1, 2) X28HC64P-12 RRZ
-40 to +85
0 to +70
28 Ld PDIP (Pb-free)
28 Ld PDIP (Pb-free)
E28.6
E28.6
X28HC64S-12* ,
**
X28HC64S-12 RR
0 to +70
28 Ld SOIC (300 mil)
M28.3
X28HC64SI-12*
X28HC64SIZ-12* (Note 1)
X28HC64SZ-12 (Note 1)
X28HC64SI-12 RR
X28HC64SI-12 RRZ
X28HC64S-12 RRZ
-40 to +85
-40 to +85
0 to +70
28 Ld SOIC (300 mil)
28 Ld SOIC (300 mil) (Pb-free)
28 Ld SOIC (300 mil) (Pb-free)
M28.3
M28.3
M28.3
*Add “T1” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
***Add “T2” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
2. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing
applications.
2
FN8109.2
August 28, 2009
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相关代理商/技术参数 |
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|---|---|
| X28HC64P-50 | 制造商:XICOR 制造商全称:Xicor Inc. 功能描述:5 Volt, Byte Alterable E2PROM |
| X28HC64P-55 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8 EEPROM |
| X28HC64P70 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:IC |
| X28HC64P-70 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Intersil Corporation 功能描述: |
| X28HC64P-90 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Intersil Corporation 功能描述: |
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