参数资料
型号: XA3S1600E-4FGG484I
厂商: Xilinx Inc
文件页数: 9/37页
文件大小: 0K
描述: IC FPGA SPARTAN-3E 1600K 484FBGA
标准包装: 60
系列: Spartan®-3E XA
LAB/CLB数: 3688
逻辑元件/单元数: 33192
RAM 位总计: 663552
输入/输出数: 376
门数: 1600000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 484-BBGA
供应商设备封装: 484-FBGA
DS635 (v2.0) September 9, 2009
Product Specification
17
R
Table 16: Propagation Times for the IOB Input Path
Symbol
Description
Conditions
IFD_
DELAY_
VALUE
Device
-4 Speed
Grade
Units
Max
Propagation Times
TIOPLI
The time it takes for data to
travel from the Input pin through
the IFF latch to the I output with
no input delay programmed
LVCMOS25(2),
IFD_DELAY_VALUE = 0
0
All
2.25
ns
TIOPLID
The time it takes for data to
travel from the Input pin through
the IFF latch to the I output with
the input delay programmed
LVCMOS25(2),
IFD_DELAY_VALUE =
default software setting
2
XA3S100E
5.97
ns
3
XA3S250E
6.33
ns
2
XA3S500E
6.49
ns
5
XA3S1200E
8.15
ns
4
XA3S1600E
7.16
ns
Notes:
1.
The numbers in this table are tested using the methodology presented in Table 19 and are based on the operating conditions set forth in
2.
This propagation time requires adjustment whenever a signal standard other than LVCMOS25 is assigned to the data Input. When this is
true, add the appropriate Input adjustment from Table 17.
Table 17: Input Timing Adjustments by IOSTANDARD
Convert Input Time from
LVCMOS25 to the Following
Signal Standard
(IOSTANDARD)
Add the
Adjustment Below
Units
-4 Speed Grade
Single-Ended Standards
LVTTL
0.43
ns
LVCMOS33
0.43
ns
LVCMOS25
0
ns
LVCMOS18
0.98
ns
LVCMOS15
0.63
ns
LVCMOS12
0.27
ns
PCI33_3
0.42
ns
HSTL_I_18
0.12
ns
HSTL_III_18
0.17
ns
SSTL18_I
0.30
ns
SSTL2_I
0.15
ns
Differential Standards
LVDS_25
0.49
ns
BLVDS_25
0.39
ns
MINI_LVDS_25
0.49
ns
LVPECL_25
0.27
ns
RSDS_25
0.49
ns
DIFF_HSTL_I_18
0.49
ns
DIFF_HSTL_III_18
0.49
ns
DIFF_SSTL18_I
0.30
ns
DIFF_SSTL2_I
0.32
ns
Notes:
1.
The numbers in this table are tested using the methodology
presented in Table 19 and are based on the operating conditions
set forth in Table 6, Table 9, and Table 11.
2.
These adjustments are used to convert input path times originally
specified for the LVCMOS25 standard to times that correspond to
other signal standards.
Table 17: Input Timing Adjustments by IOSTANDARD
Convert Input Time from
LVCMOS25 to the Following
Signal Standard
(IOSTANDARD)
Add the
Adjustment Below
Units
-4 Speed Grade
相关PDF资料
PDF描述
XCV100E-7FG256C IC FPGA 1.8V C-TEMP 256-FBGA
25LC160B-E/P IC EEPROM 16KBIT 10MHZ 8DIP
FMC18DRAS-S734 CONN EDGECARD 36POS .100 R/A SLD
XCV100E-6FG256I IC FPGA 1.8V I-TEMP 256-FBGA
ACC50DRYN-S734 CONN EDGECARD 100PS DIP .100 SLD
相关代理商/技术参数
参数描述
XA3S1600E-4FGG484Q 功能描述:IC FPGA SPARTAN-3E 1600K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3S200-4FTG256I 功能描述:IC FPGA SPARTAN-3 200K 256-FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S200-4FTG256Q 功能描述:IC FPGA SPARTAN-3 200K 256-FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S200-4PQG208I 功能描述:IC FPGA SPARTAN-3 200K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA3S200-4PQG208Q 功能描述:IC FPGA SPARTAN-3 200K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)