参数资料
| 型号： | XA3S250E-4FTG256I |
| 厂商： | Xilinx Inc |
| 文件页数： | 1/37页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-3E 250K 456-FBGA |
| 标准包装： | 90 |
| 系列： | Spartan®-3E XA |
| LAB/CLB数： | 612 |
| 逻辑元件/单元数： | 5508 |
| RAM 位总计： | 221184 |
| 输入/输出数： | 172 |
| 门数： | 250000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FTBGA |
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DS635 (v2.0) September 9, 2009
Product Specification
1
2007–2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other
countries. PCI, PCIe, and PCI Express are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
Summary
The Xilinx Automotive (XA) Spartan-3E family of FPGAs
is specifically designed to meet the needs of high-volume,
cost-sensitive automotive electronics applications. The
five-member family offers densities ranging from 100,000 to
1.6 million system gates, as shown in Table 1.
Introduction
XA devices are available in both extended-temperature
Q-Grade (–40°C to +125°C TJ) and I-Grade (–40°C to
+100°C TJ) and are qualified to the industry recognized
AEC-Q100 standard.
The XA Spartan-3E family builds on the success of the ear-
lier XA Spartan-3 family by increasing the amount of logic
per I/O, significantly reducing the cost per logic cell. New
features improve system performance and reduce the cost
of configuration. These XA Spartan-3E FPGA enhance-
ments, combined with advanced 90 nm process technology,
deliver more functionality and bandwidth per dollar than was
previously possible, setting new standards in the program-
mable logic industry.
Because of their exceptionally low cost, XA Spartan-3E
FPGAs are ideally suited to a wide range of automotive
applications, including infotainment, driver information, and
driver assistance modules.
The XA Spartan-3E family is a superior alternative to mask
programmed ASICs and ASSPs. FPGAs avoid the high ini-
tial mask set costs and lengthy development cycles, while
also permitting design upgrades in the field with no hard-
ware replacement necessary because of its inherent pro-
grammability, an impossibility with conventional ASICs and
ASSPs with their inflexible hardware architecture.
Features
Very low-cost, high-performance logic solution for
high-volume automotive applications
Proven advanced 90-nanometer process technology
Multi-voltage, multi-standard SelectIO interface pins
-
Up to 376 I/O pins or 156 differential signal pairs
-
LVCMOS, LVTTL, HSTL, and SSTL single-ended
signal standards
-
3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
-
622+ Mb/s data transfer rate per I/O
-
True LVDS, RSDS, mini-LVDS, differential
HSTL/SSTL differential I/O
-
Enhanced Double Data Rate (DDR) support
-
DDR SDRAM support up to 266 Mb/s
Abundant, flexible logic resources
-
Densities up to 33,192 logic cells, including
optional shift register or distributed RAM support
-
Efficient wide multiplexers, wide logic
-
Fast look-ahead carry logic
-
Enhanced 18 x 18 multipliers with optional pipeline
-
IEEE 1149.1/1532 JTAG programming/debug port
Hierarchical SelectRAM memory architecture
-
Up to 648 Kbits of fast block RAM
-
Up to 231 Kbits of efficient distributed RAM
Up to eight Digital Clock Managers (DCMs)
-
Clock skew elimination (delay locked loop)
-
Frequency synthesis, multiplication, division
-
High-resolution phase shifting
-
Wide frequency range (5 MHz to over 300 MHz)
Eight global clocks plus eight additional clocks per
each half of device, plus abundant low-skew routing
Configuration interface to industry-standard PROMs
-
Low-cost, space-saving SPI serial Flash PROM
-
x8 or x8/x16 parallel NOR Flash PROM
support
MicroBlaze and PicoBlaze
embedded processor
cores
Fully compliant 32-/64-bit 33 MHz PCI technology
support
Low-cost QFP and BGA packaging options
-
Common footprints support easy density migration
Refer to Spartan-3E FPGA Family: Complete Data Sheet
(DS312) for a full product description, AC and DC specifica-
tions, and package pinout descriptions. Any values shown
specifically in this XA Spartan-3E Automotive FPGA Family
data sheet override those shown in DS312.
For information regarding reliability qualification, refer to
RPT081 (Xilinx Spartan-3E Family Automotive Qualification
Report) and RPT012 (Spartan-3/3E UMC-12A 90 nm Qual-
ification Report).
37
XA Spartan-3E Automotive
FPGA Family Data Sheet
DS635 (v2.0) September 9, 2009
0
Product Specification
R
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| XA3S250E-4FTG256Q | 功能描述:IC FPGA SPARTAN-3E 250K 456-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S250E-4PQG208I | 功能描述:IC FPGA SPARTAN-3E 250K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S250E-4PQG208Q | 功能描述:IC FPGA SPARTAN-3E 250K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S250E-4TQG144I | 功能描述:IC FPGA SPARTAN-3E 250K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S250E-4TQG144Q | 功能描述:IC FPGA SPARTAN-3E 250K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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