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参数资料
| 型号： | XC17S40XLPD8C |
| 厂商： | Xilinx Inc |
| 文件页数： | 9/11页 |
| 文件大小： | 0K |
| 描述： | IC PROM PROG C-TEMP 3.3V 8-DIP |
| 产品变化通告： | Product Discontinuation 28/Jul/2010 |
| 标准包装： | 50 |
| 可编程类型： | OTP |
| 存储容量： | 400kb |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
| 其它名称： | 122-1273 XC17S40XLPD8C-ND |
Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL)
DS030 (v1.12) June 20, 2008
Product Specification
7
R
XC17S05XL, XC17S10XL, XC17S20XL, XC17S30XL, XC17S40XL, XC17S50XL,
XC17S100XL, XC17S150XL
Absolute Maximum Ratings(1)
Operating Conditions(1)
DC Characteristics Over Operating Condition
Symbol
Description
Value
Units
VCC
Supply voltage relative to GND
–0.5 to +4.0
V
VIN
Input voltage with respect to GND
–0.5 to VCC +0.5
V
VTS
Voltage applied to High-Z output
–0.5 to VCC +0.5
V
TSTG
Storage temperature (ambient)
–65 to +150
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time can affect device reliability.
Symbol
Description
Min
Max
Units
VCC
Commercial
Supply voltage relative to GND (TA = 0°C to +70°C)
3.0
3.6
V
Industrial
Supply voltage relative to GND (TA = –40°C to +85°C)
3.0
3.6
V
Notes:
1.
During normal read operation both VCC pins must be connected together.
Symbol
Description
Min
Max
Units
VIH
High-level input voltage
2.0
VCC
V
VIL
Low-level input voltage
0
0.8
V
VOH
High-level output voltage (IOH = –3 mA)
2.4
–
V
VOL
Low-level output voltage (IOL = +3 mA)
–
0.4
V
ICCA
Supply current, active mode (at maximum frequency)
–
5
mA
ICCS
Supply current, standby mode
–
50(1)
μA
IL
Input or output leakage current
–10
10
μA
CIN
Input Capacitance (VIN = GND, f = 1.0 MHz)
–
10
pF
COUT
Output Capacitance (VIN = GND, f = 1.0 MHz)
–
10
pF
Notes:
1.
ICCS standby current is specified for DATA pin that is pulled to VCC or GND.
Product Obsolete or Under Obsolescence
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相关代理商/技术参数 |
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| XC17S40XLPD8I | 功能描述:IC PROM PROG I-TEMP 3.3V 8-DIP RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S40XLPDG8C | 功能描述:IC PROM PROG C-TEMP 3.3V 8-DIP RoHS:是 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S40XLSO20C | 功能描述:IC PROM PROG C-TEMP 3.3V 20-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S40XLSO20I | 功能描述:IC PROM PROG I-TEMP 3.3V 20-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S40XLSO20I0166 | 制造商:Xilinx 功能描述: |
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