参数资料
型号: XC2S100-5FG256I
厂商: Xilinx Inc
文件页数: 8/99页
文件大小: 0K
描述: IC FPGA 2.5V I-TEMP 256-FBGA
标准包装: 90
系列: Spartan®-II
LAB/CLB数: 600
逻辑元件/单元数: 2700
RAM 位总计: 40960
输入/输出数: 176
门数: 100000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 256-BGA
供应商设备封装: 256-FBGA(17x17)
Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
16
R
Development System
Spartan-II FPGAs are supported by the Xilinx ISE
development tools. The basic methodology for Spartan-II
FPGA design consists of three interrelated steps: design
entry, implementation, and verification. Industry-standard
tools are used for design entry and simulation, while Xilinx
provides proprietary architecture-specific tools for
implementation.
The Xilinx development system is integrated under a single
graphical interface, providing designers with a common
user interface regardless of their choice of entry and
verification tools. The software simplifies the selection of
implementation options with pull-down menus and on-line
help.
For HDL design entry, the Xilinx FPGA development
system provides interfaces to several synthesis design
environments.
A standard interface-file specification, Electronic Design
Interchange Format (EDIF), simplifies file transfers into and
out of the development system.
Spartan-II FPGAs supported by a unified library of standard
functions. This library contains over 400 primitives and
macros, ranging from 2-input AND gates to 16-bit
accumulators, and includes arithmetic functions,
comparators, counters, data registers, decoders, encoders,
I/O functions, latches, Boolean functions, multiplexers, shift
registers, and barrel shifters.
The design environment supports hierarchical design entry.
These hierarchical design elements are automatically
combined by the implementation tools. Different design
entry tools can be combined within a hierarchical design,
thus allowing the most convenient entry method to be used
for each portion of the design.
Design Implementation
The place-and-route tools (PAR) automatically provide the
implementation flow described in this section. The
partitioner takes the EDIF netlist for the design and maps
the logic into the architectural resources of the FPGA (CLBs
and IOBs, for example). The placer then determines the
best locations for these blocks based on their
interconnections and the desired performance. Finally, the
router interconnects the blocks.
The PAR algorithms support fully automatic implementation
of most designs. For demanding applications, however, the
user can exercise various degrees of control over the
process. User partitioning, placement, and routing
information is optionally specified during the design-entry
process. The implementation of highly structured designs
can benefit greatly from basic floorplanning.
The implementation software incorporates timing-driven
placement and routing. Designers specify timing
requirements along entire paths during design entry. The
timing path analysis routines in PAR then recognize these
user-specified requirements and accommodate them.
Timing requirements are entered in a form directly relating
to the system requirements, such as the targeted clock
frequency, or the maximum allowable delay between two
registers. In this way, the overall performance of the system
along entire signal paths is automatically tailored to
user-generated specifications. Specific timing information
for individual nets is unnecessary.
Design Verification
In addition to conventional software simulation, FPGA users
can use in-circuit debugging techniques. Because Xilinx
devices are infinitely reprogrammable, designs can be
verified in real time without the need for extensive sets of
software simulation vectors.
The development system supports both software simulation
and in-circuit debugging techniques. For simulation, the
system extracts the post-layout timing information from the
design database, and back-annotates this information into
the netlist for use by the simulator. Alternatively, the user
can verify timing-critical portions of the design using the
static timing analyzer.
For in-circuit debugging, the development system includes
a download cable, which connects the FPGA in the target
system to a PC or workstation. After downloading the
design into the FPGA, the designer can read back the
contents of the flip-flops, and so observe the internal logic
state. Simple modifications can be downloaded into the
system in a matter of minutes.
Figure 10: Boundary Scan Bit Sequence
Bit 0 ( TDO end)
Bit 1
Bit 2
TDO.T
TDO.O
Top-edge IOBs (Right to Left)
Left-edge IOBs (Top to Bottom)
MODE.I
Bottom-edge IOBs (Left to Right)
Right-edge IOBs (Bottom to Top)
BSCANT.UPD
(TDI end)
DS001_10_032300
相关PDF资料
PDF描述
93LC76B-E/SN IC EEPROM 8KBIT 2MHZ 8SOIC
XC6SLX16-3CPG196I IC FPGA SPARTAN 6 14K 196CPGBGA
25LC020AT-E/OT IC EEPROM 2KBIT 10MHZ SOT23-6
24LC16BT-E/MC IC EEPROM 16KBIT 400KHZ 8DFN
24FC64T-I/ST IC EEPROM 64KBIT 1MHZ 8TSSOP
相关代理商/技术参数
参数描述
XC2S1005FG456C 制造商:Xilinx 功能描述:
XC2S100-5FG456C 功能描述:IC FPGA 2.5V 600 CLB'S 456-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-II 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)
XC2S100-5FG456I 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-II 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC2S100-5FGG256C 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC2S100-5FGG256I 功能描述:IC SPARTAN-II FPGA 100K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)