参数资料
型号: XC6SLX75T-3FG676I
厂商: Xilinx Inc
文件页数: 39/89页
文件大小: 0K
描述: IC FPGA SPARTAN 6 676FGGBGA
标准包装: 40
系列: Spartan® 6 LXT
LAB/CLB数: 5831
逻辑元件/单元数: 74637
RAM 位总计: 3170304
输入/输出数: 348
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 676-BGA
供应商设备封装: 676-FBGA(27x27)
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.0) October 17, 2011
Product Specification
44
Various
LVDS_33
16
N/A
16
N/A
LVDS_25
20
N/A
20
N/A
BLVDS_25
20
48
20
MINI_LVDS_33
13
N/A
13
N/A
MINI_LVDS_25
18
N/A
18
N/A
RSDS_33
12
N/A
12
N/A
RSDS_25
15
N/A
15
N/A
TMDS_33
83
N/A
83
N/A
PPDS_33
12
N/A
12
N/A
PPDS_25
16
N/A
16
N/A
DISPLAY_PORT
42
40
42
30
I2C
47
55
47
42
SMBUS
44
52
44
40
Notes:
1.
SSO limits greater than the number of I/O per VCCO/GND pair (Table 33) indicate No Limit for the given I/O standard. They are provided in
this table to calculate limits when using multiple I/O standards in a bank.
2.
Not available (N/A) indicates that the I/O standard is not available in the given bank.
3.
When used with the MCB, these signals are exempt from SSO analysis due to the known activity of the MCB switching patterns. SSO
performance is validated for all MCB instances. MCB outputs can, in some cases, exceed the SSO limits.
Table 34: SSO Limit per VCCO/GND Pair (Cont’d)
VCCO
I/O Standard
Drive
Slew
SSO Limit per VCCO/GND Pair
All TQG144, CPG196,
CSG225, FT(G)256, and
LX devices in CSG324
All CS(G)484, FG(G)484,
FG(G)676, FG(G)900, and
LXT devices in CSG324
Bank 0/2
Bank 1/3
Bank 0/2
Bank 1/3/4/5
相关PDF资料
PDF描述
25LC128T-E/SM IC EEPROM 128KBIT 10MHZ 8SOIC
XC6SLX75T-3FGG676I IC FPGA SPARTAN 6 74K 676FGGBGA
25LC128-E/SN IC EEPROM 128KBIT 10MHZ 8SOIC
AMC30DRYS-S734 CONN EDGECARD 60POS DIP .100 SLD
12600-S-10 THUMBSCREW LOCK SDR SHELL 0.18"
相关代理商/技术参数
参数描述
XC6SLX75T-3FGG484C 功能描述:IC FPGA SPARTAN 6 74K 484FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6SLX75T-3FGG484I 功能描述:IC FPGA SPARTAN 6 74K 484FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6SLX75T-3FGG676C 功能描述:IC FPGA SPARTAN 6 74K 676FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6SLX75T-3FGG676I 功能描述:IC FPGA SPARTAN 6 74K 676FGGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6SLX75T-4CSG484C 功能描述:IC FPGA SPARTAN 6 74K 484CSGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan® 6 LXT 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789