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参数资料
| 型号： | XCF02SVO20C |
| 厂商： | Xilinx Inc |
| 文件页数： | 11/35页 |
| 文件大小： | 0K |
| 描述： | IC PROM IN SYST PRG 3.3V 20TSSOP |
| 标准包装： | 74 |
| 可编程类型： | 系统内可编程 |
| 存储容量： | 2Mb |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 20-TSSOP |
| 包装： | 管件 |
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Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010
Product Specification
19
R
TCYCO
Clock period(7) (serial mode) when VCCO = 3.3V or 2.5V
30
–
ns
Clock period(7) (serial mode) when VCCO = 1.8V
30
–
ns
Clock period(7) (parallel mode) when VCCO = 3.3V or 2.5V
35
–
ns
Clock period(7) (parallel mode) when VCCO = 1.8V
35
–
ns
TLC
CLK Low time(3) when VCCO = 3.3V or 2.5V
12
–
ns
CLK Low time(3) when VCCO = 1.8V
12
–
ns
THC
CLK High time(3) when VCCO = 3.3V or 2.5V
12
–
ns
CLK High time(3) when VCCO = 1.8V
12
–
ns
THCE
CE hold time (guarantees counters are reset)(5) when VCCO = 3.3V or 2.5V
2000
–
ns
CE hold time (guarantees counters are reset)(5) when VCCO = 1.8V
2000
–
ns
THOE
OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 3.3V or 2.5V
2000
–
ns
OE/RESET hold time (guarantees counters are reset)(6) when VCCO = 1.8V
2000
–
ns
TSB
BUSY setup time to CLKOUT when VCCO = 3.3V or 2.5V
12
–
ns
BUSY setup time to CLKOUT when VCCO = 1.8V
12
–
ns
THB
BUSY hold time to CLKOUT when VCCO = 3.3V or 2.5V
8
–
ns
BUSY hold time to CLKOUT when VCCO = 1.8V
8
–
ns
TCLKO
CLK input to CLKOUT output delay when VCCO = 3.3V or 2.5V
–
35
ns
CLK input to CLKOUT output delay when VCCO = 1.8V
–
35
ns
CLK input to CLKOUT output delay when VCCO = 3.3V or 2.5V
with decompression(12)
–35
ns
CLK input to CLKOUT output delay when VCCO = 1.8V
with decompression(12)
–35
ns
TCECC
CE to CLKOUT delay(8) when VCCO = 3.3V or 2.5V
0
2 CLK
cycles
–
CE to CLKOUT delay(8) when VCCO = 1.8V
0
2 CLK
cycles
–
TOECC
OE/RESET to CLKOUT delay(8) when VCCO = 3.3V or 2.5V
02 CLK
cycles
–
OE/RESET to CLKOUT delay(8) when VCCO = 1.8V
02 CLK
cycles
–
TCFCC
CF to CLKOUT delay(8) when VCCO = 3.3V or 2.5V
0
–
CF to CLKOUT delay(8) when VCCO = 1.8V
0
–
TCCDD
CLKOUT to data delay when VCCO = 3.3V or 2.5V(9)
–30
ns
CLKOUT to data delay when VCCO = 1.8V(9)
–30
ns
TDDC
Data setup time to CLKOUT when VCCO = 3.3V or 2.5V with decompression(9)(12)
5ns
Data setup time to CLKOUT when VCCO = 1.8V with decompression(9)(12)
5ns
TCOH
Data hold from CLKOUT when VCCO = 3.3V or 2.5V
3
–
ns
Data hold from CLKOUT when VCCO = 1.8V
3
–
ns
Data hold from CLKOUT when VCCO = 3.3V or 2.5V with decompression(12)
3–
ns
Data hold from CLKOUT when VCCO = 1.8V with decompression(12)
3–
ns
TSXT
EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 3.3V or 2.5V
300
–
ns
EN_EXT_SEL setup time to CF, CE, or OE/RESET when VCCO = 1.8V
300
–
ns
Symbol
Description
XCF08P, XCF16P,
XCF32P
Units
Min
Max
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| XCF02SVOG20C | 功能描述:IC PROM SRL FOR 2M GATE 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
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