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| 型号： | XCF02SVO20C |
| 厂商： | Xilinx Inc |
| 文件页数： | 2/35页 |
| 文件大小： | 0K |
| 描述： | IC PROM IN SYST PRG 3.3V 20TSSOP |
| 标准包装： | 74 |
| 可编程类型： | 系统内可编程 |
| 存储容量： | 2Mb |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 20-TSSOP |
| 包装： | 管件 |
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Platform Flash In-System Programmable Configuration PROMs
DS123 (v2.18) May 19, 2010
Product Specification
10
R
Initiating FPGA Configuration
The options for initiating FPGA configuration via the
Platform Flash PROM include:
Automatic configuration on power up
Applying an external pulse to the FPGA PROGRAM_B
pin
Applying the JTAG CONFIG instruction to the PROM
Following the FPGA’s power-on sequence or the assertion
of the PROGRAM_B pin, the FPGA’s configuration memory
is cleared, the configuration mode is selected, and the
FPGA is ready to accept a new configuration bitstream. The
FPGA’s PROGRAM_B pin can be controlled by an external
source, or alternatively, the Platform Flash PROMs
incorporate a CF pin that can be tied to the FPGA’s
PROGRAM_B pin. Executing the CONFIG instruction
through JTAG pulses the CF output Low once for
300-500 ns, resetting the FPGA and initiating configuration.
The iMPACT software can issue the JTAG CONFIG
command to initiate FPGA configuration by setting the
“Load FPGA” option.
When using the XCFxxP Platform Flash PROM with design
revisioning enabled, the CF pin should always be connected
to the PROGRAM_B pin on the FPGA to ensure that the
current design revision selection is sampled when the
FPGA is reset. The XCFxxP PROM samples the current
design revision selection from the external REV_SEL pins
or the internal programmable Revision Select bits on the
rising edge of CF. When the JTAG CONFIG command is
executed, the XCFxxP samples the new design revision
selection before initiating the FPGA configuration
sequence. When using the XCFxxP Platform Flash PROM
without design revisioning, if the CF pin is not connected to
the FPGA PROGRAM_B pin, then the XCFxxP CF pin must
be tied High.
X-Ref Target - Figure 5
Figure 5: Design Revision Storage Examples
REV 0
(8 Mbits)
REV 1
(8 Mbits)
REV 2
(8 Mbits)
REV 3
(8 Mbits)
REV 0
(8 Mbits)
REV 1
(8 Mbits)
REV 2
(16 Mbits)
REV 0
(16 Mbits)
REV 1
(16 Mbits)
REV 0
(8 Mbits)
REV 1
(24 Mbits)
REV 0
(32 Mbits)
4 Design Revisions
3 Design Revisions
2 Design Revisions
1 Design Revision
(a) Design Revision storage examples for a single XCF32P PROM
REV 0
(16 Mbits)
REV 1
(16 Mbits)
REV 2
(16 Mbits)
REV 3
(16 Mbits)
REV 0
(16 Mbits)
REV 1
(16 Mbits)
REV 2
(32 Mbits)
REV 0
(32 Mbits)
REV 1
(32 Mbits)
REV 0
(16 Mbits)
REV 1
(16 Mbits)
REV 0
(32 Mbits)
4 Design Revisions
3 Design Revisions
2 Design Revisions
1 Design Revision
(b) Design Revision storage examples spanning two XCF32P PROMs
PROM 0
REV 0
(32 Mbits)
REV 1
(32 Mbits)
PROM 1
ds123_20_102103
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相关代理商/技术参数 |
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| XCF02SVO48 | 制造商:XILINX 制造商全称:XILINX 功能描述:Platform Flash In-System Programmable Configuration PROMS |
| XCF02SVOG20C | 功能描述:IC PROM SRL FOR 2M GATE 20-TSSOP RoHS:是 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
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