参数资料
型号: XCS30XL-4TQ84C
厂商: Xilinx, Inc.
英文描述: Spartan and Spartan-XL Families Field Programmable Gate Arrays
中文描述: 斯巴达和Spartan - xL的家庭现场可编程门阵列
文件页数: 34/82页
文件大小: 863K
代理商: XCS30XL-4TQ84C
Spartan and Spartan-XL Families Field Programmable Gate Arrays
4
DS060 (v1.6) September 19, 2001
1-800-255-7778
Product Specification
R
A CLB can implement any of the following functions:
Any function of up to four variables, plus any second
function of up to four unrelated variables, plus any third
function of up to three unrelated variables
Note: When three separate functions are generated, one of
the function outputs must be captured in a flip-flop internal to
the CLB. Only two unregistered function generator outputs
are available from the CLB.
Any single function of five variables
Any function of four variables together with some
functions of six variables
Some functions of up to nine variables.
Implementing wide functions in a single block reduces both
the number of blocks required and the delay in the signal
path, achieving both increased capacity and speed.
The versatility of the CLB function generators significantly
improves system speed. In addition, the design-software
tools can deal with each function generator independently.
This flexibility improves cell usage.
Flip-Flops
Each CLB contains two flip-flops that can be used to regis-
ter (store) the function generator outputs. The flip-flops and
function generators can also be used independently (see
Figure 2). The CLB input DIN can be used as a direct input
to either of the two flip-flops. H1 can also drive either
flip-flop via the H-LUT with a slight additional delay.
The two flip-flops have common clock (CK), clock enable
(EC) and set/reset (SR) inputs. Internally both flip-flops are
also controlled by a global initialization signal (GSR) which
is described in detail in Global Signals: GSR and GTS,
Latches (Spartan-XL only)
The Spartan-XL CLB storage elements can also be config-
ured as latches. The two latches have common clock (K)
and clock enable (EC) inputs. Functionality of the storage
element is described in Table 2.
Figure 2: Spartan/XL Simplified CLB Logic Diagram (some features not shown)
G4
G
H1
F
G4
G3
G2
G1
DYQ
Y
X
SR
CK
EC
Q
G1
SR
H1
DIN
G
H
Logic
Function
of
G1-G4
Logic
Function
of
F-G-H1
Multiplexer Controlled
by Configuration Program
G-LUT
F4
F3
F2
F1
K
EC
G
Logic
Function
of
F1-F4
F-LUT
H-LUT
A
B
DXQ
SR
CK
EC
Q
DS060_02_0506 01
相关PDF资料
PDF描述
XCS30XL-4TQ84I Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30XL-4VQ144C Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30XL-4VQ208C Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30XL-4VQ208I Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30XL-4VQ240C Spartan and Spartan-XL Families Field Programmable Gate Arrays
相关代理商/技术参数
参数描述
XCS30XL-4TQ84I 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL Families Field Programmable Gate Arrays
XCS30XL-4TQG144C 功能描述:IC SPARTAN-XL FPGA 30K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XCS30XL-4TQG144I 功能描述:IC SPARTAN-XL FPGA 30K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XCS30XL-4VQ100C 功能描述:IC FPGA 3.3V C-TEMP HP 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XCS30XL-4VQ100I 功能描述:IC FPGA 3.3V I-TEMP HP 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789