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| 型号： | XCS30XL-4TQ84C |
| 厂商： | Xilinx, Inc. |
| 英文描述： | Spartan and Spartan-XL Families Field Programmable Gate Arrays |
| 中文描述： | 斯巴达和Spartan - xL的家庭现场可编程门阵列 |
| 文件页数： | 37/82页 |
| 文件大小： | 863K |
| 代理商： | XCS30XL-4TQ84C |
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
42
DS060 (v1.6) September 19, 2001
1-800-255-7778
Product Specification
R
Spartan Detailed Specifications
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or families. Values
are subject to change. Use as estimates, not for production.
Preliminary: Based on preliminary characterization. Further changes are not expected.
Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.
Notwithstanding the definition of the above terms, all specifications are subject to change without notice.
Except for pin-to-pin input and output parameters, the AC parameter delay specifications included in this document are
derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
temperature conditions. The parameters included are common to popular designs and typical applications.
Spartan Absolute Maximum Ratings(1)
Spartan Recommended Operating Conditions
Symbol
Description
Value
Units
VCC
Supply voltage relative to GND
–0.5 to +7.0
V
VIN
Input voltage relative to GND(2,3)
–0.5 to VCC +0.5
V
VTS
Voltage applied to 3-state output(2,3)
–0.5 to VCC +0.5
V
TSTG
Storage temperature (ambient)
–65 to +150
°C
TJ
Junction temperature
Plastic packages
+125
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2.
Maximum DC overshoot (above VCC) or undershoot (below GND) must be limited to either 0.5V or 10 mA, whichever is easier to
achieve.
3.
Maximum AC (during transitions) conditions are as follows; the device pins may undershoot to –2.0V or overshoot to +7.0V, provided
this overshoot or undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
4.
For soldering guidelines, see the Package Infomation on the Xilinx website.
Symbol
Description
Min
Max
Units
VCC
Supply voltage relative to GND, TJ = 0°C to +85°C
Commercial
4.75
5.25
V
Supply voltage relative to GND, TJ = –40°C to +100°C(1) Industrial
4.5
5.5
V
VIH
High-level input voltage(2)
TTL inputs
2.0
VCC
V
CMOS inputs
70%
100%
VCC
VIL
Low-level input voltage(2)
TTL inputs
0
0.8
V
CMOS inputs
0
20%
VCC
TIN
Input signal transition time
-
250
ns
Notes:
1.
At junction temperatures above those listed as Recommended Operating Conditions, all delay parameters increase by 0.35% per
°C.
2.
Input and output measurement thresholds are: 1.5V for TTL and 2.5V for CMOS.
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相关代理商/技术参数 |
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|---|---|
| XCS30XL-4TQ84I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL Families Field Programmable Gate Arrays |
| XCS30XL-4TQG144C | 功能描述:IC SPARTAN-XL FPGA 30K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XCS30XL-4TQG144I | 功能描述:IC SPARTAN-XL FPGA 30K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XCS30XL-4VQ100C | 功能描述:IC FPGA 3.3V C-TEMP HP 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XCS30XL-4VQ100I | 功能描述:IC FPGA 3.3V I-TEMP HP 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
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