参数资料
型号: XCS30XL-4TQG144C
厂商: Xilinx Inc
文件页数: 37/83页
文件大小: 0K
描述: IC SPARTAN-XL FPGA 30K 144-TQFP
产品变化通告: Product Discontinuation 26/Oct/2011
标准包装: 60
系列: Spartan®-XL
LAB/CLB数: 576
逻辑元件/单元数: 1368
RAM 位总计: 18432
输入/输出数: 113
门数: 30000
电源电压: 3 V ~ 3.6 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 144-LQFP
供应商设备封装: 144-TQFP(20x20)
产品目录页面: 599 (CN2011-ZH PDF)
其它名称: 122-1297
Spartan and Spartan-XL FPGA Families Data Sheet
42
DS060 (v2.0) March 1, 2013
Product Specification
R
Product Obsolete/Under Obsolescence
Spartan Family Detailed Specifications
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or families. Values
are subject to change. Use as estimates, not for production.
Preliminary: Based on preliminary characterization. Further changes are not expected.
Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.
Notwithstanding the definition of the above terms, all specifications are subject to change without notice.
Except for pin-to-pin input and output parameters, the AC parameter delay specifications included in this document are
derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction
temperature conditions. The parameters included are common to popular designs and typical applications.
Spartan Family Absolute Maximum Ratings(1)
Spartan Family Recommended Operating Conditions
Symbol
Description
Value
Units
VCC
Supply voltage relative to GND
–0.5 to +7.0
V
VIN
Input voltage relative to GND(2,3)
–0.5 to VCC +0.5
V
VTS
Voltage applied to 3-state output(2,3)
–0.5 to VCC +0.5
V
TSTG
Storage temperature (ambient)
–65 to +150
°C
TJ
Junction temperature
Plastic packages
+125
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2.
Maximum DC overshoot (above VCC) or undershoot (below GND) must be limited to either 0.5V or 10 mA, whichever is easier to
achieve.
3.
Maximum AC (during transitions) conditions are as follows; the device pins may undershoot to –2.0V or overshoot to +7.0V, provided
this overshoot or undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
4.
For soldering guidelines, see the Package Information on the Xilinx website.
Symbol
Description
Min
Max
Units
VCC
Supply voltage relative to GND, TJ = 0°C to +85°CCommercial
4.75
5.25
V
Supply voltage relative to GND, TJ = –40°C to +100°C(1) Industrial
4.5
5.5
V
VIH
High-level input voltage(2)
TTL inputs
2.0
VCC
V
CMOS inputs
70%
100%
VCC
VIL
Low-level input voltage(2)
TTL inputs
0
0.8
V
CMOS inputs
0
20%
VCC
TIN
Input signal transition time
-
250
ns
Notes:
1.
At junction temperatures above those listed as Recommended Operating Conditions, all delay parameters increase by 0.35% per
°C.
2.
Input and output measurement thresholds are: 1.5V for TTL and 2.5V for CMOS.
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