参数资料
| 型号： | XCS30XL-4TQG144C |
| 厂商： | Xilinx Inc |
| 文件页数： | 59/83页 |
| 文件大小： | 0K |
| 描述： | IC SPARTAN-XL FPGA 30K 144-TQFP |
| 产品变化通告： | Product Discontinuation 26/Oct/2011 |
| 标准包装： | 60 |
| 系列： | Spartan®-XL |
| LAB/CLB数： | 576 |
| 逻辑元件/单元数： | 1368 |
| RAM 位总计： | 18432 |
| 输入/输出数： | 113 |
| 门数： | 30000 |
| 电源电压： | 3 V ~ 3.6 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 144-LQFP |
| 供应商设备封装： | 144-TQFP（20x20） |
| 产品目录页面： | 599 (CN2011-ZH PDF) |
| 其它名称： | 122-1297 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页当前第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页
Spartan and Spartan-XL FPGA Families Data Sheet
62
DS060 (v2.0) March 1, 2013
Product Specification
R
Product Obsolete/Under Obsolescence
Pin Descriptions
There are three types of pins in the Spartan/XL devices:
Permanently dedicated pins
User I/O pins that can have special functions
Unrestricted user-programmable I/O pins.
Before and during configuration, all outputs not used for the
configuration process are 3-stated with the I/O pull-up resis-
tor network activated. After configuration, if an IOB is
unused it is configured as an input with the I/O pull-up resis-
tor network remaining activated.
Any user I/O can be configured to drive the Global
Set/Reset net GSR or the global three-state net GTS. See
Global Signals: GSR and GTS, page 20 for more informa-
tion.
Device pins for Spartan/XL devices are described in
Some Spartan-XL devices are available in Pb-free package
options. The Pb-free package options have the same pin-
outs as the standard package options.
Table 18: Pin Descriptions
Pin Name
I/O
During
Config.
I/O After
Config.
Pin Description
Permanently Dedicated Pins
VCC
X
Eight or more (depending on package) connections to the nominal +5V supply
voltage (+3.3V for Spartan-XL devices). All must be connected, and each must be
decoupled with a 0.01 –0.1
μF capacitor to Ground.
GND
X
Eight or more (depending on package type) connections to Ground. All must be
connected.
CCLK
I or O
I
During configuration, Configuration Clock (CCLK) is an output in Master mode and
is an input in Slave mode. After configuration, CCLK has a weak pull-up resistor
and can be selected as the Readback Clock. There is no CCLK High or Low time
restriction on Spartan/XL devices, except during Readback. See Violating the
for an explanation of this exception.
DONE
I/O
O
DONE is a bidirectional signal with an optional internal pull-up resistor. As an
open-drain output, it indicates the completion of the configuration process. As an
input, a Low level on DONE can be configured to delay the global logic initialization
and the enabling of outputs.
The optional pull-up resistor is selected as an option in the program that creates
the configuration bitstream. The resistor is included by default.
PROGRAM
II
PROGRAM is an active Low input that forces the FPGA to clear its configuration
memory. It is used to initiate a configuration cycle. When PROGRAM goes High,
the FPGA finishes the current clear cycle and executes another complete clear
cycle, before it goes into a WAIT state and releases INIT.
The PROGRAM pin has a permanent weak pull-up, so it need not be externally
pulled up to VCC.
MODE
(Spartan)
M0, M1
(Spartan-XL)
I
X
The Mode input(s) are sampled after INIT goes High to determine the
configuration mode to be used.
During configuration, these pins have a weak pull-up resistor. For the most popular
configuration mode, Slave Serial, the mode pins can be left unconnected. For
Master Serial mode, connect the Mode/M0 pin directly to system ground.
相关PDF资料 |
PDF描述 |
|---|---|
| KXPC823VR66B2T | IC MPU POWERQUICC 66MHZ 256-PBGA |
| XF2J-182412A | CONN FPC 18POS 0.5MM SMT |
| FMC50DREI-S734 | CONN EDGECARD 100POS .100 EYELET |
| KMPC860DTCVR66D4 | IC MPU POWERQUICC 66MHZ 357-PBGA |
| FMC60DREF-S13 | CONN EDGECARD 120POS .100 EXTEND |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XCS30XL-4TQG144I | 功能描述:IC SPARTAN-XL FPGA 30K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XCS30XL-4VQ100C | 功能描述:IC FPGA 3.3V C-TEMP HP 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XCS30XL-4VQ100I | 功能描述:IC FPGA 3.3V I-TEMP HP 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XCS30XL-4VQ144C | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL Families Field Programmable Gate Arrays |
| XCS30XL-4VQ144I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL Families Field Programmable Gate Arrays |
发布紧急采购，3分钟左右您将得到回复。